Telephone Circuit, CMOS, PDIP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Holtek |
| package instruction | DIP, DIP20(UNSPEC) |
| Reach Compliance Code | unknown |
| crystal frequency | 3.58 MHz |
| JESD-30 code | R-PDIP-T20 |
| JESD-609 code | e0 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 2 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |





| HT9315FD | HT9315FBT | HT9315FC | HT9315FA | HT9315FCT | HT9315FB | HT9315FDT | HT9315FAT | |
|---|---|---|---|---|---|---|---|---|
| Description | Telephone Circuit, CMOS, PDIP20 | Telephone Circuit, CMOS, PDIP24 | Telephone Circuit, CMOS, PDIP20 | Telephone Circuit, CMOS, PDIP18 | Telephone Circuit, CMOS, PDIP22 | Telephone Circuit, CMOS, PDIP22 | Telephone Circuit, CMOS, PDIP28 | Telephone Circuit, CMOS, PDIP20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Holtek | Holtek | Holtek | Holtek | Holtek | Holtek | Holtek | Holtek |
| package instruction | DIP, DIP20(UNSPEC) | SDIP, SDIP24(UNSPEC) | DIP, DIP20(UNSPEC) | DIP, DIP18(UNSPEC) | DIP, DIP22(UNSPEC) | DIP, DIP22(UNSPEC) | DIP, DIP28(UNSPEC) | DIP, DIP20(UNSPEC) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| crystal frequency | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz |
| JESD-30 code | R-PDIP-T20 | R-PDIP-T24 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T22 | R-PDIP-T22 | R-PDIP-T28 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 20 | 24 | 20 | 18 | 22 | 22 | 28 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SDIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20(UNSPEC) | SDIP24(UNSPEC) | DIP20(UNSPEC) | DIP18(UNSPEC) | DIP22(UNSPEC) | DIP22(UNSPEC) | DIP28(UNSPEC) | DIP20(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE, SHRINK PITCH | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |