Port Options for HFBR-11xx/21xx
Series Components
Technical Data
Simplex Module Options
Features
• PMC (PCI Mezzanine Card)
Compliant Packaging Style
with Maximum 9.8 mm
Height
• Multisourced Compact
16-Pin DIP Package with
Plastic SC, Metal ST and FC
Port Style
• Wave Solder and Aqueous
Wash Process Compatible
• Manufactured in an ISO
9001 Certified Facility
Package
The package outline drawings are
shown in Figure 1a, 1b, and 1c.
The pin-outs are the same as the
standard, 16-pin DIP plastic ST
package style.
Ordering Information
The SC plastic and the ST/FC
metal port options are available
with the following part numbers.
The standard ST plastic product
part numbers are the same part
numbers as listed below except
with the letter “T” suffix, e.g.,
HFBR-111xT/-211xT.
Plastic Connector
SC Tx Part # Baud/Distance
HFBR-11E5
125 MBd / 2 km
HFBR-11E6
155 MBd / 2 km
HFBR-11E9
266 MBd / 2 km
SC Rx Part #
HFBR-21E5
HFBR-21E6
HFBR-21E9
Baud/Distance
125 MBd / 2 km
155 MBd / 2 km
266 MBd / 2 km
ST Rx Part #
HFBR-2115M
HFBR-2116M
HFBR-2119M
FC Tx Part #
HFBR-11F5M
HFBR-11F6M
HFBR-11F9M
FC Rx Part #
HFBR-21F5M
HFBR-21F6M
HFBR-21F9M
Baud/Distance
125 MBd / 2 km
155 MBd / 2 km
266 MBd / 2 km
Baud/Distance
125 MBd / 2 km
155 MBd / 2 km
266 MBd / 2 km
Baud/Distance
125 MBd / 2 km
155 MBd / 2 km
266 MBd / 2 km
Applications
• Versions Available for the
Following Applications:
- FDDI/Fast Ethernet/ATM
100 Mbps
- ATM 155 Mbps
- Fibre Channel and
Proprietary Application
Description
The port options for the HFBR-
11xx/21xx Series components
give designers additional plastic
and metal port options for
various serial optical data com-
munication applications. These
port options have the same
electrical and optical perform-
ance as the standard products.
Reliability Information
The port options use the same
semiconductor devices and
manufacturing processes as the
standard plastic ST 16-pin DIP
modules. Therefore, the reliability
data of the standard parts is
directly applicable.
Metal Connector
ST Tx Part # Baud/Distance
HFBR-1115M
125 MBd / 2 km
HFBR-1116M
155 MBd / 2 km
HFBR-1119M
266 MBd / 2 km
5965-8664E (5/97)
211
TOP
HFBR-11EX/21EX
DATE CODE (YYWW)
COUNTRY OF ORIGIN
12.19 MAX.
40.5 MAX.
3.80
10.00
5.0
0.9
9.8 MAX.
3
2.45
15.95
PIN 9
17.78
(7 x 2.54)
PIN 16
12.7
8 x 7.62
PIN 8
BOTTOM
NOTES:
1. I/O PIN MATERIAL IS PHOSPHOR BRONZE WITH 120 MICROINCHES
TIN LEAD (90/10) COATING OVER 50 MICROINCHES NICKEL PLATING.
2. Rx HAS NO PINS AT #10 AND #16.
3. Tx HAS NO PIN AT #7.
4. PINS 1, 8, 9, AND 16 ARE HOUSING PINS. DIMENSIONS ARE 0.38 x 0.5 mm.
MATERIAL ALLOY 194, 1/2 H - 0.38 THK FINISH MATTE TIN PLATE 7.6 µm MIN.
5. DIMENSIONS ARE IN MILLIMETERS (INCHES).
PIN 1
PCB PINS
DIA. 0.46 mm
NOTE 1
Figure 1a. SC Package Outline Drawing.
212
TOP
4.04
HFBR-111XM/211XM
DATE CODE (YYWW)
COUNTRY OF ORIGIN
8.31
12.19 MAX.
41 MAX.
7.01
5.0
0.9
9.8 MAX.
3
2.45
19.72
PIN 9
17.78
(7 x 2.54)
PIN 16
8 x 7.62
PIN 8
BOTTOM
PIN 1
PCB PINS
DIA. 0.46 mm
NOTE 1
NOTES:
1. I/O PIN MATERIAL IS PHOSPHOR BRONZE WITH 120 MICROINCHES
TIN LEAD (90/10) COATING OVER 50 MICROINCHES NICKEL PLATING.
2. Rx HAS NO PINS AT #10 AND #16.
3. Tx HAS NO PIN AT #7.
4. PINS 1, 8, 9, AND 16 ARE HOUSING PINS. DIMENSIONS ARE 0.38 x 0.5 mm.
MATERIAL ALLOY 194, 1/2 H - 0.38 THK FINISH MATTE TIN PLATE 7.6 µm MIN.
5. DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 1b. ST Package Outline Drawing.
213
TOP
THREADS
M8 x 0.75
9.6
(0.38)
HFBR-11FXM/21FXM
DATE CODE (YYWW)
COUNTRY OF ORIGIN
12.19 MAX.
3.88
(0.153)
33.5 MAX.
∅
8.1
(0.32)
7.1
(0.28)
5.0
7.9
(0.31)
0.9
9.8 MAX.
3
2.45
PIN 9
17.78
(7 x 2.54)
PIN 16
8 x 7.62
PIN 8
BOTTOM
PIN 1
PCB PINS
DIA. 0.46 mm
NOTE 1
NOTES:
1. I/O PIN MATERIAL IS PHOSPHOR BRONZE WITH 120 MICROINCHES
TIN LEAD (90/10) COATING OVER 50 MICROINCHES NICKEL PLATING.
2. Rx HAS NO PINS AT #10 AND #16.
3. Tx HAS NO PIN AT #7.
4. PINS 1, 8, 9, AND 16 ARE HOUSING PINS. DIMENSIONS ARE 0.38 x 0.5 mm.
MATERIAL ALLOY 194, 1/2 H - 0.38 THK FINISH MATTE TIN PLATE 7.6 µm MIN.
5. DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 1c. FC Package Outline Drawing.
214
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