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5962-01-229-1655

Description
IC,PRESCALER,DIP,24PIN,CERAMIC
Categorylogic    logic   
File Size542KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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5962-01-229-1655 Overview

IC,PRESCALER,DIP,24PIN,CERAMIC

5962-01-229-1655 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.6
Reach Compliance Code_compli
JESD-30 codeR-XDIP-T24
Load/preset inputYES
Logic integrated circuit typePRESCALER
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Maximum supply current (ICC)50 mA
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

5962-01-229-1655 Related Products

5962-01-229-1655 CD4059AE CD4059AD3 CD4059AK3 CD4059AK CD4059AF3 5962-01-208-9456
Description IC,PRESCALER,DIP,24PIN,CERAMIC DIVIDE BYN COUNTER 4000/14000/40000 SERIES, ASYN POSITIVE EDGE TRIGGERED DOWN DIVIDE BY N COUNTER, CDIP24, CERAMIC, DIP-24 CD4059AK3 CD4059AK IC,PRESCALER,DIP,24PIN,CERAMIC IC,PRESCALER,DIP,24PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code _compli not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-XDIP-T24 R-PDIP-T24 R-CDIP-T24 R-XDFP-F24 R-XDFP-F24 R-XDIP-T24 R-XDIP-T24
Logic integrated circuit type PRESCALER DIVIDE BY N COUNTER DIVIDE BY N COUNTER PRESCALER PRESCALER PRESCALER PRESCALER
Number of terminals 24 24 24 24 24 24 24
Maximum operating temperature 125 °C 85 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -40 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DFP DFP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 FL24,.4 FL24,.4 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Maximum supply current (ICC) 50 mA 50 mA 50 mA 50 mA 50 mA 50 mA 50 mA
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 - - DIP, DIP24,.6 DIP, DIP24,.6
Load/preset input YES YES YES - - YES YES
Base Number Matches 1 1 1 1 1 - -
JESD-609 code - e0 e0 e0 e0 e0 -
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
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