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CD4059AE

Description
DIVIDE BYN COUNTER
Categorylogic    logic   
File Size542KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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CD4059AE Overview

DIVIDE BYN COUNTER

CD4059AE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.6
Reach Compliance Codenot_compliant
JESD-30 codeR-PDIP-T24
JESD-609 codee0
Load/preset inputYES
Logic integrated circuit typeDIVIDE BY N COUNTER
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Maximum supply current (ICC)50 mA
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

CD4059AE Related Products

CD4059AE 5962-01-229-1655 CD4059AD3 CD4059AK3 CD4059AK CD4059AF3 5962-01-208-9456
Description DIVIDE BYN COUNTER IC,PRESCALER,DIP,24PIN,CERAMIC 4000/14000/40000 SERIES, ASYN POSITIVE EDGE TRIGGERED DOWN DIVIDE BY N COUNTER, CDIP24, CERAMIC, DIP-24 CD4059AK3 CD4059AK IC,PRESCALER,DIP,24PIN,CERAMIC IC,PRESCALER,DIP,24PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-PDIP-T24 R-XDIP-T24 R-CDIP-T24 R-XDFP-F24 R-XDFP-F24 R-XDIP-T24 R-XDIP-T24
Logic integrated circuit type DIVIDE BY N COUNTER PRESCALER DIVIDE BY N COUNTER PRESCALER PRESCALER PRESCALER PRESCALER
Number of terminals 24 24 24 24 24 24 24
Maximum operating temperature 85 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC, METAL-SEALED COFIRED CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DFP DFP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 FL24,.4 FL24,.4 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Maximum supply current (ICC) 50 mA 50 mA 50 mA 50 mA 50 mA 50 mA 50 mA
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 - - DIP, DIP24,.6 DIP, DIP24,.6
JESD-609 code e0 - e0 e0 e0 e0 -
Load/preset input YES YES YES - - YES YES
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Base Number Matches 1 1 1 1 1 - -
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