CD4059AK3
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-XDFP-F24 |
| JESD-609 code | e0 |
| Logic integrated circuit type | PRESCALER |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL24,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5/15 V |
| Maximum supply current (ICC) | 50 mA |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| CD4059AK3 | 5962-01-229-1655 | CD4059AE | CD4059AD3 | CD4059AK | CD4059AF3 | 5962-01-208-9456 | |
|---|---|---|---|---|---|---|---|
| Description | CD4059AK3 | IC,PRESCALER,DIP,24PIN,CERAMIC | DIVIDE BYN COUNTER | 4000/14000/40000 SERIES, ASYN POSITIVE EDGE TRIGGERED DOWN DIVIDE BY N COUNTER, CDIP24, CERAMIC, DIP-24 | CD4059AK | IC,PRESCALER,DIP,24PIN,CERAMIC | IC,PRESCALER,DIP,24PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-XDFP-F24 | R-XDIP-T24 | R-PDIP-T24 | R-CDIP-T24 | R-XDFP-F24 | R-XDIP-T24 | R-XDIP-T24 |
| Logic integrated circuit type | PRESCALER | PRESCALER | DIVIDE BY N COUNTER | DIVIDE BY N COUNTER | PRESCALER | PRESCALER | PRESCALER |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP | DFP | DIP | DIP |
| Encapsulate equivalent code | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Maximum supply current (ICC) | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | - |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| package instruction | - | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | - | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Load/preset input | - | YES | YES | YES | - | YES | YES |
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