M54HC27F1 datasheet, PDF - EEWORLD Datasheet

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M54HC27F1: DescriptionHC/UH SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14; Categorylogic logic; File Size100KB，4 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M54HC27F1 Overview

HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14

M54HC27F1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14
Reach Compliance Code	not_compliant
series	HC/UH
JESD-30 code	R-GDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
MaximumI(ol)	0.004 A
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/6 V
Prop。Delay @ Nom-Sup	27 ns
propagation delay (tpd)	27 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	5 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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M54HC27F1 Related Products

	M54HC27F1	M74HC27B1N	M74HC27M1	M74HC27F1	M74HC27C1
Description	HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, PDIP14, PLASTIC, DIP-14	HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14	HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, TRIPLE 3-INPUT NOR GATE, PQCC20, PLASTIC, CC-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	DIP	DIP	SOIC	DIP	QFN
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	MICRO, PLASTIC, GULLWING, DIP-14	DIP, DIP14,.3	PLASTIC, CC-20
Contacts	14	14	14	14	20
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	_compli
series	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-GDIP-T14	R-PDIP-T14	R-PDSO-G14	R-GDIP-T14	S-PQCC-J20
JESD-609 code	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	3	3	3	3	3
Number of entries	3	3	3	3	3
Number of terminals	14	14	14	14	20
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	DIP	QCCJ
Encapsulate equivalent code	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	LDCC20,.4SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
propagation delay (tpd)	27 ns	23 ns	23 ns	23 ns	23 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum seat height	5 mm	5.1 mm	1.75 mm	5 mm	4.57 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	3.9 mm	7.62 mm	8.9662 mm
Prop。Delay @ Nom-Sup	27 ns	23 ns	23 ns	23 ns	-

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