Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Height Above
PC Board
in. (mm)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
Footprint
Dimensions
in. (mm)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
TO-220 and TO-218
Standard
P/N
Without Pin
Plain Pin
634-10AB
634-10ABEP
634-15AB
634-15ABEP
634-20AB
634-20ABEP
Material: Aluminum, Black Anodized.
Weight
lbs. (grams)
0.016 (7.48
0.025 (11.21)
0.033 (14.95)
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
MECHANICAL DIMENSIONS
Notes:
1. Thermal compound is as-
sumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES
Standard
P/N
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
76°C @ 6W
65°C @ 6w
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
TO-220
Maximum Footprint
in. (mm)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Weight
lbs. (grams)
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
637-10ABEP
1.000 (25.4)
637-15ABEP
1.500 (38.1)
637-20ABEP
2.000 (50.8)
637-25ABEP
2.500 (63.5)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-
mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
board space occupied must be minimized. Refer to the Accessory products section for thermal
interface materials, thermal compounds, and other accessories products.
MECHANICAL DIMENSIONS
637 SERIES
(EXTRUSION PROFILE 5183)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
39
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
667 SERIES
Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
76°C @ 6W
66°C @ 6W
58°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
TO-220
Standard P/N
Plain Pin
Standoff Pin
Weight
lbs (grams)
0.0240 (11.0)
0.0340 (15.6)
0.0460 (21.0)
0.0580 (26.2)
667-10ABPP
1.000 (25.4)
1.375 (34.9) x 0.500 (12.7)
667-10ABESP
667-15ABPP
1.500 (38.1)
1.375 (34.9) x 0.500 (12.7)
667-15ABESP
667-20ABESP
667-20ABPP
2.000 (50.8)
1.375 (34.9) x 0.500 (12.7)
667-25ABPP
2.500 (63.5)
1.375 (34.9) x 0.500 (12.7)
667-25ABESP
Wave-solderable pins.
Material: Aluminum, Black Anodized
Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost.
Note: Order 330 SC or 285 SC SpeedClip™ separately.
MECHANICAL DIMENSIONS
0.500
(12.7) REF
0.093
(2.4) DIA
(NOMINAL)
STANDOFF
PINS
"SP"
667 SERIES
(EXTRUSION PROFILE 8073)
PLAIN
PINS
"PP"
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
THERMAL RESISTANCE
SINK TO AMBIENT (°C/WATT)
Speed
Clip
330SC
4 lb
Nominal
Force
Installed
Speed
Clip
285SC
10 lb
Nominal
Force
Installed
0
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT (°C)
100
80
60
0A
BP
7-1
200
AIR VELOCITY (FPM)
400
600
800
1000
5
4
1.375
(34.9) REF
0.730
(18.5)
0.062
(1.6) REF
0.670
(17.0)
A
0.125 (3.2) DIA
RAISED BOSS x 0.030 (0.8) HIGH
0.156
(4.0)
20
0
0
4
8
12
16
POWER DISSIPATION (WATTS)
66
0.044 (1.1) (STANDOFF)
0.130 (3.3)
66
40
25
7-
AB
0.180 DIA
(4.6)
1.000
(25.4)
0.093
(2.4) DIA
P
667-
10ABP
667-2
5ABP
3
2
1
0
20
Dimensions: in. (mm)
626 & 627 SERIES
Standard
P/N
High-Efficiency Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
TO-218, TO-220
Standard
P/N
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
76°C @ 6W
65°C @ 6W
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/M @ 200 LFM
626-10ABEP
627-10ABP
1.000 (25.4)
626-15ABEP
627-15ABP
1.500 (38.1)
626-20ABEP
627-20ABP
2.000 (50.8)
626-25ABEP
627-25ABP
2.500 (63-5)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
626 AND 627 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
40
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
647 SERIES
High-Performance Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
42°C @ 6W
37°C @ 6W
34°C @ 6W
31°C @ 6W
25°C @ 6W
3.8°C/W @ 200 LFM
3.5°C/W @ 200 LFM
3.3°C/W @ 200 LFM
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
TO-220
Standard
P/N
Maximum Footprint
in. (mm)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
Weight
lbs. (grams)
0.055 (24.95)
0.075 (34.02)
0.090 (40.82)
0.104 (47.17)
0.125 (56.70)
647-1OABEP
1.000 (25.4)
1.500 (38.1)
647-15ABEP
1.750 (44.5)
647-175ABEP
647-20ABEP
2.000 (50.8)
647-25ABEP
2.500 (63.5)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed
circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory
Products section for thermal interface materials, 126 Series silicone-free thermal compounds,
and other accessories products.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
647 SERIES
(EXTRUSION PROFILE 5195)
Dimensions: in. (mm)
657 SERIES
Standard
P/N
High-Performance Heat Sinks for Vertical Board Mounting
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
TO-220, TO-247, TO-218
Height Above
PC Board “A”
in. (mm)
Weight
lbs (grams)
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
657-10ABEP
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABEP
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABEP
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABEP
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
41
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES
Standard
P/N
High-Performance Notched Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
TO-220, TO-247, TO-218
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
657-10ABEPN
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-15ABEPN
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-20ABEPN
657-25ABEPN
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
657 SERIES
Standard
P/N
High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
TO-220, TO-247, TO-218
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
657-10ABEPSC
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABEPSC
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABEPSC
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABEPSC
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
677 SERIES
Standard
P/N
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
TO-218, TO-220, TO-247
15-LEAD Multiwatt
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
52°C @ 6W
46°C @ 6W
40°C @ 6W
35°C @ 6W
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
2.5°C/W @ 200 LFM
2.2°C/W @ 200 LFM
677-10ABEP
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
677-15ABEP
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
677-20ABEP
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
677-25ABEP
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
677 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
677 SERIES
(EXTRUSION PROFILE 8719)
Dimensions: in. (mm)
42
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
690 SERIES
Standard
P/N
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above
PC Board
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
44°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
Semiconductor
Mounting
Hole Pattern
(1) TO-3
(1) TO-66
(2) TO-220
TO-3, TO-66, TO-220
Outline Dimensions
in. (mm)
1.860 (47.2)-sq
1.860 (47.2)-sq
1.860 (47.2)-sq
Weight
lbs. (grams)
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
1.310 (33.3)
690-3B
1.310 (33.3)
690-66B
690-220B
1.310 (33.3)
Material: Aluminum, Black Anodized
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
690 SERIES
TO-3
TO-66
*TWO TO-220’S
Dimensions: in. (mm)
680 SERIES
Standard
P/N
Maximum Efficiency Omnidirectional Heat Sinks
Height Above
PC Board “A”
in. (mm)
Horizontal Mounting
Footprint Dimensions
in. (mm)
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
70°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
7O°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
Semiconductor
Mounting
Hole Pattern
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
TO-3, TO-220
Weight
lbs. (grams)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
680-5A
0.500 (12.7)
680-75A
0.750 (19.1)
680-10A
1.000 (25.4)
680-125A
1.250 (31.8)
680-5220
0.500 (12.7)
680-75220
0.750 (19.1)
680-10220
1.000 (25.4)
680-125220
1.250 (31.8)
Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed
circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases,
when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in
natural convection applications. These 680 Series heat sinks can also be specified without any
semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
MECHANICAL
DIMENSIONS
680 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
A
220
K
Dimensions: in. (mm)
TO-3
*TWO TO-220’S
43
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