EEWORLDEEWORLDEEWORLD

Part Number

Search

657-20ABPEN

Description
WAKEFIELD SOLUTIONS - 657-20ABPEN - HEAT SINK
Categorysemiconductor    Analog mixed-signal IC   
File Size344KB,6 Pages
ManufacturerWAKEFIELD SOLUTIONS
Download Datasheet Compare View All

657-20ABPEN Online Shopping

Suppliers Part Number Price MOQ In stock  
657-20ABPEN - - View Buy Now

657-20ABPEN Overview

WAKEFIELD SOLUTIONS - 657-20ABPEN - HEAT SINK

Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Height Above
PC Board
in. (mm)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
Footprint
Dimensions
in. (mm)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
TO-220 and TO-218
Standard
P/N
Without Pin
Plain Pin
634-10AB
634-10ABEP
634-15AB
634-15ABEP
634-20AB
634-20ABEP
Material: Aluminum, Black Anodized.
Weight
lbs. (grams)
0.016 (7.48
0.025 (11.21)
0.033 (14.95)
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
MECHANICAL DIMENSIONS
Notes:
1. Thermal compound is as-
sumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES
Standard
P/N
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
76°C @ 6W
65°C @ 6w
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
TO-220
Maximum Footprint
in. (mm)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Weight
lbs. (grams)
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
637-10ABEP
1.000 (25.4)
637-15ABEP
1.500 (38.1)
637-20ABEP
2.000 (50.8)
637-25ABEP
2.500 (63.5)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-
mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
board space occupied must be minimized. Refer to the Accessory products section for thermal
interface materials, thermal compounds, and other accessories products.
MECHANICAL DIMENSIONS
637 SERIES
(EXTRUSION PROFILE 5183)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
39

657-20ABPEN Related Products

657-20ABPEN 667-15ABPPE 647-20ABPE 667-10ABPPE 667-20ABPPE 647-15ABPE 647-10ABPE 647-25ABPE 657-10ABP
Description WAKEFIELD SOLUTIONS - 657-20ABPEN - HEAT SINK WAKEFIELD SOLUTIONS - 667-15ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-15ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-10ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-20ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-15ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 647-10ABPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-15ABPPE - HEAT SINK WAKEFIELD SOLUTIONS - 667-15ABPPE - HEAT SINK
Flash Magic Installer
I'll upload one if I see some friends need it....
desk1983 NXP MCU
Can the frequency of ZigBeeCC2530 be changed from 2.4G to 470M?
Can the frequency of ZigBeeCC2530 be changed from 2.4G to 470M?...
高磊 RF/Wirelessly
[Decryption 13] Tank debugging based on wireless remote control handle of 51 single chip microcomputer
[align=center][font=微软雅黑][size=3][media=x,500,375]http://v.youku.com/v_show/id_XNDk2MjUwNzY0.html[/media] >>>>>>>>>>>2013-02-04<<<<<<<<<<<[/size][/font][/align][align=left][font=微软雅黑][size=3] After th...
@ZiShi DIY/Open Source Hardware
[Step by step POS machine kit] 6 - Take a look at TI's AM3715 development board
[size=4][color=red]《AM3715 Evaluation Module Hardware User Guide》 [/color][/size][size=4][color=red]《AM3715 Evaluation Module [font=Times New Roman]Quick Start Guide[/font]》[/color][/size][b][color=#0...
dontium Analogue and Mixed Signal
Important features of new test instrument systems
Andrew Armutat Product Marketing Keithley Instruments Model 2601 Single Channel System SourceMeter[1]Other Important Characteristics of SMU Systems In addition to the typical features of SMUs , Keithl...
Jack_ma Test/Measurement
Can someone explain the Rate adaptation mechanism in wireless devices?
As the title says. Specifically, when the surrounding environment changes, the speed provided by the wireless device also changes. I want to know the principle of this change....
wsb86815 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2668  770  880  1438  153  54  16  18  29  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号