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667-20ABPPE

Description
WAKEFIELD SOLUTIONS - 667-20ABPPE - HEAT SINK
Categorysemiconductor    Other integrated circuit (IC)   
File Size344KB,6 Pages
ManufacturerWAKEFIELD SOLUTIONS
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667-20ABPPE Overview

WAKEFIELD SOLUTIONS - 667-20ABPPE - HEAT SINK

Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Height Above
PC Board
in. (mm)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
Footprint
Dimensions
in. (mm)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
TO-220 and TO-218
Standard
P/N
Without Pin
Plain Pin
634-10AB
634-10ABEP
634-15AB
634-15ABEP
634-20AB
634-20ABEP
Material: Aluminum, Black Anodized.
Weight
lbs. (grams)
0.016 (7.48
0.025 (11.21)
0.033 (14.95)
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
MECHANICAL DIMENSIONS
Notes:
1. Thermal compound is as-
sumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES
Standard
P/N
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
76°C @ 6W
65°C @ 6w
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
TO-220
Maximum Footprint
in. (mm)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Weight
lbs. (grams)
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
637-10ABEP
1.000 (25.4)
637-15ABEP
1.500 (38.1)
637-20ABEP
2.000 (50.8)
637-25ABEP
2.500 (63.5)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-
mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
board space occupied must be minimized. Refer to the Accessory products section for thermal
interface materials, thermal compounds, and other accessories products.
MECHANICAL DIMENSIONS
637 SERIES
(EXTRUSION PROFILE 5183)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
39

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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