SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Universal Semiconductor Inc |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| normal position | NO |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Nominal off-state isolation | 45 dB |
| On-state resistance matching specifications | 7 Ω |
| Maximum on-state resistance (Ron) | 35 Ω |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 5000 ns |
| Maximum connection time | 5000 ns |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| USH5008-AI-C24 | USH5008-AI-K28 | USH5008-AI-L28 | USH5008-AI-P24 | USH5008-AM-C24 | USH5008-AM-L28 | |
|---|---|---|---|---|---|---|
| Description | SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24 | SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28 | SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28 | SPST, 1 Func, 8 Channel, CMOS, PDIP24, PLASTIC, DIP-24 | SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24 | SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc |
| Parts packaging code | DIP | QLCC | QFN | DIP | DIP | QFN |
| package instruction | DIP, DIP24,.3 | QCCJ, LDCC(UNSPEC) | QCCN, LCC(UNSPEC) | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC(UNSPEC) |
| Contacts | 24 | 28 | 28 | 24 | 24 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-GDIP-T24 | S-PQCC-J28 | S-CQCC-N28 | R-PDIP-T24 | R-GDIP-T24 | S-CQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| normal position | NO | NO | NO | NO | NO | NO |
| Number of channels | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 28 | 24 | 24 | 28 |
| Nominal off-state isolation | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB |
| On-state resistance matching specifications | 7 Ω | 7 Ω | 7 Ω | 7 Ω | 7 Ω | 7 Ω |
| Maximum on-state resistance (Ron) | 35 Ω | 35 Ω | 35 Ω | 35 Ω | 35 Ω | 35 Ω |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -25 °C | - | -25 °C | - | -55 °C | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCJ | QCCN | DIP | DIP | QCCN |
| Encapsulate equivalent code | DIP24,.3 | LDCC(UNSPEC) | LCC(UNSPEC) | DIP24,.3 | DIP24,.3 | LCC(UNSPEC) |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | YES | NO | NO | YES |
| Maximum disconnect time | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
| Maximum connection time | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | COMMERCIAL | OTHER | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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