USH5008-AI-K28 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> The signal circuit> USH5008-AI-K28

USH5008-AI-K28: DescriptionSPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28; CategoryAnalog mixed-signal IC The signal circuit; File Size166KB，4 Pages; ManufacturerUniversal Semiconductor Inc

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USH5008-AI-K28 Overview

SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28

USH5008-AI-K28 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Universal Semiconductor Inc
Parts packaging code	QLCC
package instruction	QCCJ, LDCC(UNSPEC)
Contacts	28
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	S-PQCC-J28
JESD-609 code	e0
normal position	NO
Number of channels	8
Number of functions	1
Number of terminals	28
Nominal off-state isolation	45 dB
On-state resistance matching specifications	7 Ω
Maximum on-state resistance (Ron)	35 Ω
Maximum operating temperature	70 °C
Minimum operating temperature
output	SEPARATE OUTPUT
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC(UNSPEC)
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	15 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	15 V
surface mount	YES
Maximum disconnect time	5000 ns
Maximum connection time	5000 ns
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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USH5008-AI-K28 Related Products

	USH5008-AI-K28	USH5008-AI-C24	USH5008-AI-L28	USH5008-AI-P24	USH5008-AM-C24	USH5008-AM-L28
Description	SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28	SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24	SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28	SPST, 1 Func, 8 Channel, CMOS, PDIP24, PLASTIC, DIP-24	SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24	SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc
Parts packaging code	QLCC	DIP	QFN	DIP	DIP	QFN
package instruction	QCCJ, LDCC(UNSPEC)	DIP, DIP24,.3	QCCN, LCC(UNSPEC)	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC(UNSPEC)
Contacts	28	24	28	24	24	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	SPST	SPST
JESD-30 code	S-PQCC-J28	R-GDIP-T24	S-CQCC-N28	R-PDIP-T24	R-GDIP-T24	S-CQCC-N28
JESD-609 code	e0	e0	e0	e0	e0	e0
normal position	NO	NO	NO	NO	NO	NO
Number of channels	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	28	24	28	24	24	28
Nominal off-state isolation	45 dB	45 dB	45 dB	45 dB	45 dB	45 dB
On-state resistance matching specifications	7 Ω	7 Ω	7 Ω	7 Ω	7 Ω	7 Ω
Maximum on-state resistance (Ron)	35 Ω	35 Ω	35 Ω	35 Ω	35 Ω	35 Ω
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-	-25 °C	-25 °C	-	-55 °C	-55 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	DIP	QCCN	DIP	DIP	QCCN
Encapsulate equivalent code	LDCC(UNSPEC)	DIP24,.3	LCC(UNSPEC)	DIP24,.3	DIP24,.3	LCC(UNSPEC)
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	15 V	15 V	15 V	15 V	15 V	15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	YES	NO	YES	NO	NO	YES
Maximum disconnect time	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns
Maximum connection time	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	OTHER	OTHER	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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