AM29803APCTB datasheet, PDF - EEWORLD Datasheet

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AM29803APCTB: DescriptionMicroprocessor Circuit, TTL, PDIP16; CategoryThe embedded processor and controller Microcontrollers and processors; File Size294KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29803APCTB Overview

Microprocessor Circuit, TTL, PDIP16

AM29803APCTB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP16,.3
Reach Compliance Code	compliant
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

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AM29803APCTB Related Products

	AM29803APCTB	AM29803ADCTB	AM29803ADCT	AM29803AFM	AM29803APCT	AM29803APCB
Description	Microprocessor Circuit, TTL, PDIP16	Microprocessor Circuit, TTL, CDIP16	Microprocessor Circuit, TTL, CDIP16	Microprocessor Circuit, TTL, CDIP16	Microprocessor Circuit, TTL, PDIP16	Microprocessor Circuit, TTL, PDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	compliant	compliant	compliant	unknown	compliant	compliant
JESD-30 code	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Maker	AMD	AMD	AMD	-	AMD	AMD

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