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AM29803APCB

Description
Microprocessor Circuit, TTL, PDIP16
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size294KB,7 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM29803APCB Overview

Microprocessor Circuit, TTL, PDIP16

AM29803APCB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
package instructionDIP, DIP16,.3
Reach Compliance Codecompliant
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

AM29803APCB Related Products

AM29803APCB AM29803ADCTB AM29803ADCT AM29803AFM AM29803APCT AM29803APCTB
Description Microprocessor Circuit, TTL, PDIP16 Microprocessor Circuit, TTL, CDIP16 Microprocessor Circuit, TTL, CDIP16 Microprocessor Circuit, TTL, CDIP16 Microprocessor Circuit, TTL, PDIP16 Microprocessor Circuit, TTL, PDIP16
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code compliant compliant compliant unknown compliant compliant
JESD-30 code R-PDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-PDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 16 16 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 125 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
surface mount NO NO NO NO NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
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