D Latch, 1-Func, 8-Bit, CMOS, CDFP20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | DFP, FL20,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-XDFP-F20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.014 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 6 |
| IDT54AHCT573EB | 5962-01-305-5389 | IDT54AHCT573DB | IDT54AHCT573LB | 74AHCT573D | 74AHCT573L | IDT74AHCT573L | |
|---|---|---|---|---|---|---|---|
| Description | D Latch, 1-Func, 8-Bit, CMOS, CDFP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CQCC20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CQCC20 | D Latch, 1-Func, 8-Bit, CMOS, CQCC20 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli | not_compliant | not_compliant |
| JESD-30 code | R-XDFP-F20 | R-XDIP-T20 | R-XDIP-T20 | S-XQCC-N20 | R-XDIP-T20 | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | BUS DRIVER | D LATCH | D LATCH |
| MaximumI(ol) | 0.014 A | 0.014 A | 0.014 A | 0.014 A | 0.024 A | 0.024 A | 0.024 A |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | QCCN | DIP | QCCN | QCCN |
| Encapsulate equivalent code | FL20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 | 225 | 225 | 225 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | 6 | 30 | 30 | 30 | 6 | 6 | 6 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | - |
| package instruction | DFP, FL20,.3 | - | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - | - |
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