WL1835MODGBMOCR datasheet, PDF

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WL1835MODGBMOCR: DescriptionWLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM; CategoryWireless rf/communication Telecom circuit; File Size1MB，50 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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WL1835MODGBMOCR Overview

WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM

WL1835MODGBMOCR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	MOC-100
Reach Compliance Code	compliant
Factory Lead Time	16 weeks
Samacsys Confidence	4
Samacsys Status	Released
Samacsys PartID	370113
Samacsys Pin Count	100
Samacsys Part Category	Integrated Circuit
Samacsys Package Category	Other
Samacsys Footprint Name	MOC0100A_1
Samacsys Released Date	2019-07-02 21:38:08
Is Samacsys	N
data rate	100000 Mbps
JESD-30 code	R-PBGA-N100
JESD-609 code	e4
length	13.4 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	100
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LGA
Encapsulate equivalent code	LGA100(UNSPEC)
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	2.9/4.8 V
Certification status	Not Qualified
Maximum seat height	2 mm
Nominal supply voltage	3.7 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.7 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13.3 mm
Base Number Matches	1

WL1835MODGBMOCR Related Products

	WL1835MODGBMOCR	WL1835MODGBMOCT	WL1801MODGBMOCR	WL1801MODGBMOCT	WL1805MODGBMOCR	WL1805MODGBMOCT	WL1831MODGBMOCR	WL1831MODGBMOCT
Description	WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM	WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module 100-QFM -20 to 70	WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin LGA Module	WiLink™ 8 single band Wi-Fi® module 100-QFM -20 to 70	WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM	WiLink™ 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70	WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM	WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	MOC-100	MOC-100	MOC-100	LGA, LGA100(UNSPEC)	-	MOC-100	MOC-100	MOC-100
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant	compliant	compliant
Factory Lead Time	16 weeks	12 weeks	12 weeks	-	-	12 weeks	26 weeks	12 weeks
Is Samacsys	N	N	N	N	-	N	N	N
data rate	100000 Mbps	100000 Mbps	100000 Mbps	100000 Mbps	-	100000 Mbps	100000 Mbps	100000 Mbps
JESD-30 code	R-PBGA-N100	R-PBGA-N100	R-PBGA-N100	R-PBGA-N100	-	R-PBGA-N100	R-PBGA-N100	R-PBGA-N100
JESD-609 code	e4	e4	e4	e4	-	e4	e4	e4
length	13.4 mm	13.4 mm	13.4 mm	13.4 mm	-	13.4 mm	13.4 mm	13.4 mm
Humidity sensitivity level	3	3	3	3	-	3	3	3
Number of functions	1	1	1	1	-	1	1	1
Number of terminals	100	100	100	100	-	100	100	100
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	-	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LGA	LGA	LGA	LGA	-	LGA	LGA	LGA
Encapsulate equivalent code	LGA100(UNSPEC)	LGA100(UNSPEC)	LGA100(UNSPEC)	LGA100(UNSPEC)	-	LGA100(UNSPEC)	LGA100(UNSPEC)	LGA100(UNSPEC)
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	260	260
power supply	2.9/4.8 V	2.9/4.8 V	2.9/4.8 V	2.9/4.8 V	-	2.9/4.8 V	2.9/4.8 V	2.9/4.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2 mm	2 mm	2 mm	2 mm	-	2 mm	2 mm	2 mm
Nominal supply voltage	3.7 V	3.7 V	3.7 V	3.7 V	-	3.7 V	3.7 V	3.7 V
surface mount	YES	YES	YES	YES	-	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	-	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	OTHER	OTHER	OTHER	OTHER	-	OTHER	OTHER	OTHER
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.7 mm	0.7 mm	0.7 mm	0.7 mm	-	0.7 mm	0.7 mm	0.7 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	13.3 mm	13.3 mm	13.3 mm	13.3 mm	-	13.3 mm	13.3 mm	13.3 mm
Base Number Matches	1	1	1	1	-	1	1	1

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