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WL1831MODGBMOCT

Description
WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,50 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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WL1831MODGBMOCT Overview

WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70

WL1831MODGBMOCT Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
package instructionMOC-100
Reach Compliance Codecompliant
ECCN code5A992.C
Factory Lead Time12 weeks
Samacsys Confidence4
Samacsys StatusReleased
Samacsys PartID297231
Samacsys Pin Count100
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryOther
Samacsys Footprint NameWL1831MODGBMOCT-2
Samacsys Released Date2019-05-13 16:40:17
Is SamacsysN
data rate100000 Mbps
JESD-30 codeR-PBGA-N100
JESD-609 codee4
length13.4 mm
Humidity sensitivity level3
Number of functions1
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLGA
Encapsulate equivalent codeLGA100(UNSPEC)
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply2.9/4.8 V
Certification statusNot Qualified
Maximum seat height2 mm
Nominal supply voltage3.7 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelOTHER
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.7 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13.3 mm
Base Number Matches1

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Description WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70 WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module 100-QFM -20 to 70 WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin LGA Module WiLink™ 8 single band Wi-Fi® module 100-QFM -20 to 70 WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM WiLink™ 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70 WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free - Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to - conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments - - Texas Instruments Texas Instruments
package instruction MOC-100 MOC-100 MOC-100 MOC-100 LGA, LGA100(UNSPEC) - MOC-100 MOC-100
Reach Compliance Code compliant compliant compliant compliant compliant - compliant compliant
Factory Lead Time 12 weeks 12 weeks 16 weeks 12 weeks - - 12 weeks 26 weeks
Is Samacsys N N N N N - N N
data rate 100000 Mbps 100000 Mbps 100000 Mbps 100000 Mbps 100000 Mbps - 100000 Mbps 100000 Mbps
JESD-30 code R-PBGA-N100 R-PBGA-N100 R-PBGA-N100 R-PBGA-N100 R-PBGA-N100 - R-PBGA-N100 R-PBGA-N100
JESD-609 code e4 e4 e4 e4 e4 - e4 e4
length 13.4 mm 13.4 mm 13.4 mm 13.4 mm 13.4 mm - 13.4 mm 13.4 mm
Humidity sensitivity level 3 3 3 3 3 - 3 3
Number of functions 1 1 1 1 1 - 1 1
Number of terminals 100 100 100 100 100 - 100 100
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C - 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C - -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LGA LGA LGA LGA LGA - LGA LGA
Encapsulate equivalent code LGA100(UNSPEC) LGA100(UNSPEC) LGA100(UNSPEC) LGA100(UNSPEC) LGA100(UNSPEC) - LGA100(UNSPEC) LGA100(UNSPEC)
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 260 260 - 260 260
power supply 2.9/4.8 V 2.9/4.8 V 2.9/4.8 V 2.9/4.8 V 2.9/4.8 V - 2.9/4.8 V 2.9/4.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 2 mm 2 mm 2 mm 2 mm 2 mm - 2 mm 2 mm
Nominal supply voltage 3.7 V 3.7 V 3.7 V 3.7 V 3.7 V - 3.7 V 3.7 V
surface mount YES YES YES YES YES - YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT - TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level OTHER OTHER OTHER OTHER OTHER - OTHER OTHER
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD - NO LEAD NO LEAD
Terminal pitch 0.7 mm 0.7 mm 0.7 mm 0.7 mm 0.7 mm - 0.7 mm 0.7 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 13.3 mm 13.3 mm 13.3 mm 13.3 mm 13.3 mm - 13.3 mm 13.3 mm
Base Number Matches 1 1 1 1 1 - 1 1
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