|
WL1805MODGBMOCR |
WL1835MODGBMOCT |
WL1835MODGBMOCR |
WL1801MODGBMOCR |
WL1801MODGBMOCT |
WL1805MODGBMOCT |
WL1831MODGBMOCR |
WL1831MODGBMOCT |
| Description |
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM |
WiLink 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module 100-QFM -20 to 70 |
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM |
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin LGA Module |
WiLink 8 single band Wi-Fi® module 100-QFM -20 to 70 |
WiLink 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70 |
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM |
WiLink 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70 |
| Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
- |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
- |
MOC-100 |
MOC-100 |
MOC-100 |
LGA, LGA100(UNSPEC) |
MOC-100 |
MOC-100 |
MOC-100 |
| Reach Compliance Code |
- |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| Factory Lead Time |
- |
12 weeks |
16 weeks |
12 weeks |
- |
12 weeks |
26 weeks |
12 weeks |
| Is Samacsys |
- |
N |
N |
N |
N |
N |
N |
N |
| data rate |
- |
100000 Mbps |
100000 Mbps |
100000 Mbps |
100000 Mbps |
100000 Mbps |
100000 Mbps |
100000 Mbps |
| JESD-30 code |
- |
R-PBGA-N100 |
R-PBGA-N100 |
R-PBGA-N100 |
R-PBGA-N100 |
R-PBGA-N100 |
R-PBGA-N100 |
R-PBGA-N100 |
| JESD-609 code |
- |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| length |
- |
13.4 mm |
13.4 mm |
13.4 mm |
13.4 mm |
13.4 mm |
13.4 mm |
13.4 mm |
| Humidity sensitivity level |
- |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
| Number of functions |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
- |
100 |
100 |
100 |
100 |
100 |
100 |
100 |
| Maximum operating temperature |
- |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| Minimum operating temperature |
- |
-20 °C |
-20 °C |
-20 °C |
-20 °C |
-20 °C |
-20 °C |
-20 °C |
| Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
- |
LGA |
LGA |
LGA |
LGA |
LGA |
LGA |
LGA |
| Encapsulate equivalent code |
- |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
LGA100(UNSPEC) |
| Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
- |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
| Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
| power supply |
- |
2.9/4.8 V |
2.9/4.8 V |
2.9/4.8 V |
2.9/4.8 V |
2.9/4.8 V |
2.9/4.8 V |
2.9/4.8 V |
| Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
- |
2 mm |
2 mm |
2 mm |
2 mm |
2 mm |
2 mm |
2 mm |
| Nominal supply voltage |
- |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
| surface mount |
- |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| Telecom integrated circuit types |
- |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
| Temperature level |
- |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
| Terminal surface |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
- |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal pitch |
- |
0.7 mm |
0.7 mm |
0.7 mm |
0.7 mm |
0.7 mm |
0.7 mm |
0.7 mm |
| Terminal location |
- |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
- |
13.3 mm |
13.3 mm |
13.3 mm |
13.3 mm |
13.3 mm |
13.3 mm |
13.3 mm |
| Base Number Matches |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |