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TMS320VC5471ZHK

Description
Digital Signal Processors & Controllers - DSP, DSC System-Level
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size795KB,96 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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Digital Signal Processors & Controllers - DSP, DSC System-Level

TMS320VC5471ZHK Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionLFBGA, BGA257,19X19,32
Contacts257
Reach Compliance Codecompli
ECCN code3A001.A.3
Other featuresALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY
Address bus width23
barrel shifterNO
bit size16
boundary scanYES
maximum clock frequency100 MHz
External data bus width32
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B257
JESD-609 codee1
length16 mm
low power modeYES
Humidity sensitivity level3
Number of terminals257
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA257,19X19,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1.8,3.3 V
Certification statusNot Qualified
RAM (number of words)16384
Maximum seat height1.4 mm
Maximum supply voltage1.95 V
Minimum supply voltage1.71 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width16 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, MIXED

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Description Digital Signal Processors & Controllers - DSP, DSC System-Level Digital Signal Processors & Controllers - DSP, DSC System-Level Digital Signal Processors & Controllers - DSP, DSC System-Level Digital Signal Processors & Controllers - DSP, DSC System-Level Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Proc
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to incompatible incompatible conform to conform to
Parts packaging code BGA BGA BGA BGA BGA
package instruction LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32 LFBGA, BGA257,19X19,32
Contacts 257 257 257 257 257
Reach Compliance Code compli _compli _compli compli compli
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY
Address bus width 23 23 23 23 23
barrel shifter NO NO NO NO NO
bit size 16 16 16 16 16
boundary scan YES YES YES YES YES
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
External data bus width 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B257 S-PBGA-B257 S-PBGA-B257 S-PBGA-B257 S-PBGA-B257
JESD-609 code e1 e0 e0 e1 e1
length 16 mm 16 mm 16 mm 16 mm 16 mm
low power mode YES YES YES YES YES
Humidity sensitivity level 3 3 3 3 3
Number of terminals 257 257 257 257 257
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA LFBGA
Encapsulate equivalent code BGA257,19X19,32 BGA257,19X19,32 BGA257,19X19,32 BGA257,19X19,32 BGA257,19X19,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 220 220 260 260
power supply 1.8,3.3 V 3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 16384 16384 16384 16384 32768
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Nominal supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 16 mm 16 mm 16 mm 16 mm 16 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED
Maker Texas Instruments Texas Instruments Texas Instruments - Texas Instruments
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