TNETV1002IDZHK datasheet, PDF - EEWORLD Datasheet

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TNETV1002IDZHK: DescriptionDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Proc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size795KB，96 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Proc

TNETV1002IDZHK Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA257,19X19,32
Contacts	257
Reach Compliance Code	compli
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY
Address bus width	23
barrel shifter	NO
bit size	16
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	32
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B257
JESD-609 code	e1
length	16 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	257
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA257,19X19,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	32768
Maximum seat height	1.4 mm
Maximum supply voltage	1.95 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, MIXED

TNETV1002IDZHK Related Products

	TNETV1002IDZHK	TMS320VC5471GHK	TMS320VC5471GHKA	TMS320VC5471ZHK	TMS320VC5471ZHKA
Description	Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Proc	Digital Signal Processors & Controllers - DSP, DSC System-Level	Digital Signal Processors & Controllers - DSP, DSC System-Level	Digital Signal Processors & Controllers - DSP, DSC System-Level	Digital Signal Processors & Controllers - DSP, DSC System-Level
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	incompatible	incompatible	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA257,19X19,32	LFBGA, BGA257,19X19,32	LFBGA, BGA257,19X19,32	LFBGA, BGA257,19X19,32	LFBGA, BGA257,19X19,32
Contacts	257	257	257	257	257
Reach Compliance Code	compli	_compli	_compli	compli	compli
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY	ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY
Address bus width	23	23	23	23	23
barrel shifter	NO	NO	NO	NO	NO
bit size	16	16	16	16	16
boundary scan	YES	YES	YES	YES	YES
maximum clock frequency	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
External data bus width	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B257	S-PBGA-B257	S-PBGA-B257	S-PBGA-B257	S-PBGA-B257
JESD-609 code	e1	e0	e0	e1	e1
length	16 mm	16 mm	16 mm	16 mm	16 mm
low power mode	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3
Number of terminals	257	257	257	257	257
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA257,19X19,32	BGA257,19X19,32	BGA257,19X19,32	BGA257,19X19,32	BGA257,19X19,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	220	220	260	260
power supply	1.8,3.3 V	3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	32768	16384	16384	16384	16384
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16 mm	16 mm	16 mm	16 mm	16 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, MIXED
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-

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