The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
High-Speed (3.125Gbps) Stacking Connectors
FX8C Series
sMechanical
features
q
0.6mm Pitch
q
Stacking Height : 5~16mm
q
Number of Contacts : 60, 80, 100, 120, 140,
q
SMT Coplanarity
q
Mating Guide
160, 200, 240, 280
The coplanarity of the SMT solder area lead is
maintained at the high accuracy of less than 0.1mm.
The very small and guide rib is provided, and secures
±0.6mm self-alignment, considering the mating
operativity into accounts. ( fig.1 )
2
Effective Mating Length
fig.1
H
+0.3
-0.2
q
Effective Mating Length : 2mm ( fig.1 )
q
Mis-insertion Prevention
q
Two-piece Connection Product
The boss prevents mis-insertion in the board to cause
due to the boss position and boss diameter.
In order to enhance the mating reliability for fine pitch
connector using two-pieces, the two-pieces of
connectors are combined by our unique method, and
can secure the mount position accuracy. In such a
new concept, the two-piece connected product is
prepared at every number of contacts ( The standard
mating pitch for the two-piece interconnected product
in two rows is 11mm. )
H:Stacking Height
0.6
0.6
s
Signal integrity features
q
Insertion-Loss-to-Crosstalk-Ratio ( ICR )
The insertion-loss-to-crosstalk ratio (ICR) with
five-aggressor differential FEXT meets the IEEE
802.3ap specification for 3.125
+
Gbps with plenty
of margins.
The differential impedance is within 100±10 ohms
at 100 ps rise time (20% to 80%).
q
Differential Impedance
s
Stacking height variations (5mm~16mm)
Receptacle
Header
FX8C-**P-SV
FX8C-** / **P11-SVJ
FX8C-**P-SV1
FX8C-** / **P11-SV1J
FX8C-**P-SV2
FX8C-**/**P11-SV2J
FX8C-**P-SV4
FX8C-** / **P11-SV4J
FX8C-**P-SV6
FX8C-** / **P11-SV6J
FX8C-**S-SV
FX8C-** / **S11-SVJ
5mm
6mm
7mm
9mm
11mm
FX8C-**S-SV5
FX8C-** / **S11-SV5J
10mm
5∼16
11mm
12mm
14mm
16mm
9
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
5.
Humidity (Steady state)
Contact resistance: 100m
ohms
max.Insulation resistance: 100M
ohms
min.
96 hours at temperature of 40 ± 2ç and humidity of 90% to 95%
Contact resistance: 100m
ohms
max.Insulation resistance: 100M
ohms
min. (-55ç: 30 minutes, 15
to
35ç: 2
to
3 minutes
(-85ç:
30 minutes, 15
to
35ç: 2
to
3minutes) 5 cycles
7. Durability (Mating/un-mating) Contact resistance: 100m
ohms
max.
50 cycles
8. Resistance to Soldering heat
No deformation of components affecting performance. Reflow: At the recommended temperature profile
Manual soldering: 360ç for 5 seconds
Note 1 : Includes temperature rise caused by current flow.
Note 2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and
Humidity range covers non conducting condition of installed connectors in storage, shipment or during transportation.
Note 3 : Slight variations in color of the plastic compounds do not affect form ,fit or function of the connector.
Note 4 : FX8C-*P-SV(*),FX8C-*S-SV(*) is gold plated.
Note 5 : Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a
specific part number shown.
sMaterial
Part
Insulator
Header Contact
Receptacle Contact
Material
PPS
Phosphor bronze
Phosphor bronze
Finish
Light brown
Contact area
Lead area
Contact area
Lead area
Gold plated
Tin plated(Note 4)
Gold plated
Tin plated(Note 4)
Remarks
UL94V-0
–––––––
–––––––
sOrdering
Information
qSingle
Product
FX8C
q
- 120 P - SV 1 (91)
w
e
r
t
y
t
Product height variation Blank : Standard (Minimum low profile)
1:
+1mm
. . . . . . 6:+6mm
y
Packaging Type
(71) : Tray packaging
(91) : Tube packaging
(92) : Embossed tape package
q
Series Name : FX8C
w
Number of Contacts :60, 80, 100, 120, 140
e
Connector type
r
Contact type
P :Header
S :Receptacle
SV :Board vertical type
qtwo-piece
Connection Product
FX8C
q
- 120/120 P 11 - SV 1 J
w
e
r
t
y u
r
Connector to Connector Pitch
t
Contact type
SV : Board vertical type
y
Product Height VariationBlank : Standard (Minimum lot profile)
1:+1mm . . . . . . 6:+6mm
u
J: two-piece connection product
q
Series Name :FX8C
w
Number of Contacts: 60∞2, 80∞2, 100∞2,
120∞2, 140∞2
Example: 120/120 = 240 contacts
e
Connector Type :
P : Header
S : Receptacle
*The
standard packaging of the two-piece connection product is the tray packaging.
10
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
To match 100 ohm differential impedance and to reduce crosstalk, a staggered GSGSG pin assignment is recommended for
FX8C of 5mm to 9mm height, and a staggered GSSG pin assignment is recommended for 10mm to 16mm height. (G=ground
and S=signal)
GSGSG
GSSG
signal
ground
q
Impedance
The differential impedance is 100 ± 10 ohm for FX8C of 5mm and 16mm height at 100 ps rise time (20% to 80%).
5mm
16mm
q
Propagation delay
The propagation delay is 69 and 118 ps for FX8C of 5mm and 16mm height, respectively.
q
Insertion loss
The differential insertion loss crosses 1 dB at 7 and 5 GHz for FX8C of 5mm and 16mm height, respectively.
5mm
16mm
11
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
The differential return loss meets the IEEE 802.3ap specification to 10 and 7 GHz for FX8C of 5mm and 16mm height,
respectively.
5mm
16mm
q
Near-end crosstalk (NEXT)
The staggered GSGSG and GSSG pin assignments resulted in low differential NEXT.
5mm
16mm
12
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
At first I thought it would be difficult, but it turned out to be quite simple. Basic circuit knowledge can be used to facilitate development using EasyPower...
I use C to write source code, and MSP430 also needs to write a BOOTSTRAP LOADER program. The bootstrap loader program is written to facilitate the PC to burn the application code to the MCU. How does ...
[table=98%][tr][td][font=宋体][size=12px]What are your opinions on analog power and digital power, analog ground and digital ground? I have read some discussions on this issue on the Internet, but I sti...
[i=s]This post was last edited by tiankai001 on 2014-6-5 07:13[/i] [align=center][b][size=4]Comprehensive Electronic System Design and Practice[/size][/b][/align] [align=center][b][size=4] [/size][/b]...
introduction
1 The significance of using RTOS on MSP430
It is understandable that it is meaningless to use RTOS on MSP430. Because the hardware resources of MSP430 are limited (for exampl...[Details]
1. Introduction
RFID (radio frequency identification) is a non-contact automatic identification technology that emerged in the 1990s. It uses the characteristics of radio frequency signal prop...[Details]
introduction
my country has a vast territory and a large population. The scale of housing construction is huge, and the amount of residential construction is large and wide. It is still on t...[Details]
The Portable Digital Data Acquisition System (PDDAS) uses LabVIEW Real-Time and PXI to control the wind tunnel test and record air pressure data from 128 different channels.
"The LabVIEW Real-...[Details]
Abstract: In order to generate a stable excitation signal, the design of a digital frequency synthesizer is implemented on FPGA using Verilog hardware language. The design includes accumulator, wav...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
Electronic systems are located at different points on the automotive power bus and therefore often need to operate under very stringent power requirements. These include load dump, cold crank, very lo...[Details]
Power management solutions for today's portable application processors are becoming increasingly integrated. Total power consumption, standby and sleep current consumption affect battery size, bill...[Details]
My colleague and I spent the day chatting in the hotel bar. We had met with several customers. We were both wondering how come these engineers we were meeting knew almost nothing about analog techn...[Details]
1 Introduction
As an emerging microfabrication technology, micro-electromechanical system (MEMS) technology has begun to be applied in various fields. It can integrate functions such as inform...[Details]
Instrument stepper motor
The stepper motor is an open-loop control element that converts electrical pulse signals into angular displacement or linear displacement. In the case of non...[Details]
1. Introduction
Testing the temperature of steel billets before rolling is an important measure to ensure the quality of steel. Traditional manual testing is difficult to ensure product qu...[Details]
In the analysis of electronic circuits, static analysis (also known as DC analysis) is the basis of circuit analysis. However, it is well known that electronic components are nonlinear, so the anal...[Details]
RS-422 and RS-485 are both serial data interface standards, which were developed and published by the Electronic Industries Association (EIA). RS-422 defines a balanced communication interface with a ...[Details]
Flooded Batteries
This battery developed in Germany can be used to power flashlights, strobe lights and toys as long as it is filled with water. This battery can be stored for 50 years and can...[Details]
_pdf/pg_0001.png)
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD_pdf/1.png)
_pdf/2.png)
_pdf/3.png)
_pdf/4.png)
_pdf/5.png)
_pdf/pg_0002.png)
_pdf/pg_0003.png)
_pdf/pg_0004.png)
_pdf/pg_0005.png)
