OMAPL137BHKGD1 datasheet, PDF - EEWORLD Datasheet

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OMAPL137BHKGD1: DescriptionHigh Temperature Low Power Applications Processor 0-XCEPT -40 to 90; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，205 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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OMAPL137BHKGD1 Overview

High Temperature Low Power Applications Processor 0-XCEPT -40 to 90

OMAPL137BHKGD1 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DIE
package instruction	DIE,
Contacts	257
Reach Compliance Code	compli
ECCN code	3A001.A.2.A
Address bus width	13
barrel shifter	NO
boundary scan	YES
maximum clock frequency	30 MHz
External data bus width	8
Format	FLOATING POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	X-XUUC-N257
low power mode	YES
Number of DMA channels	40
Number of terminals	257
Number of timers	4
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	175 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
RAM (number of words)	499712
ROM programmability	MROM
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

OMAPL137BHKGD1 Related Products

	OMAPL137BHKGD1	OMAPL137BPTPH
Description	High Temperature Low Power Applications Processor 0-XCEPT -40 to 90	High Temperature Low Power Applications Processor 176-HLQFP 0 to 90
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	DIE	QFP
package instruction	DIE,	HLFQFP, QFP176,1.0SQ,20
Contacts	257	176
Reach Compliance Code	compli	compli
ECCN code	3A001.A.2.A	3A001.A.2.A
barrel shifter	NO	NO
boundary scan	YES	YES
maximum clock frequency	30 MHz	50 MHz
Format	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES
Internal bus architecture	MULTIPLE	MULTIPLE
JESD-30 code	X-XUUC-N257	S-PQFP-G176
low power mode	YES	YES
Number of DMA channels	40	40
Number of terminals	257	176
Number of timers	4	4
On-chip data RAM width	8	8
On-chip program ROM width	8	8
Maximum operating temperature	175 °C	175 °C
Minimum operating temperature	-55 °C	-55 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	DIE	HLFQFP
Package shape	UNSPECIFIED	SQUARE
Package form	UNCASED CHIP	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260
RAM (number of words)	499712	499712
ROM programmability	MROM	MROM
Maximum supply voltage	1.32 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	NO LEAD	GULL WING
Terminal location	UPPER	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1

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