EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

BUF634P

Description
250mA High-Speed Buffer 8-PDIP -40 to 125
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size1MB,31 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Related ProductsFound15parts with similar functions to BUF634P
Stay tuned Parametric Compare

BUF634P Online Shopping

Suppliers Part Number Price MOQ In stock  
BUF634P - - View Buy Now

BUF634P Overview

250mA High-Speed Buffer 8-PDIP -40 to 125

BUF634P Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeDIP
package instructionDIP, DIP8,.3
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
Samacsys Descripti250-mA high-speed buffer - see BUF634A for upgraded versi
Amplifier typeBUFFER
Maximum average bias current (IIB)20 µA
Nominal bandwidth (3dB)180 MHz
Maximum bias current (IIB) at 25C20 µA
Maximum input offset voltage100000 µV
JESD-30 codeR-PDIP-T8
JESD-609 codee4
length9.59 mm
Negative supply voltage upper limit-18 V
Nominal Negative Supply Voltage (Vsup)-15 V
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
method of packingTUBE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply+-15 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Nominal slew rate2000 V/us
Maximum slew rate20 mA
Supply voltage upper limit18 V
Nominal supply voltage (Vsup)15 V
surface mountNO
technologyBIPOLAR
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

BUF634P Related Products

BUF634P BUF634T BUF634U BUF634FKTTT BUF634TG3 BUF634FKTTTE3 BUF634UE4
Description 250mA High-Speed Buffer 8-PDIP -40 to 125 250mA High-Speed Buffer 5-TO-220 -40 to 125 250mA High-Speed Buffer 8-SOIC -40 to 125 250mA High-Speed Buffer 5-DDPAK/TO-263 -40 to 125 250mA High-Speed Buffer 5-TO-220 -40 to 125 250mA High-Speed Buffer 5-DDPAK/TO-263 -40 to 125 250mA High-Speed Buffer 8-SOIC -40 to 125
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code DIP SFM SOIC D2PAK SFM D2PAK SOIC
package instruction DIP, DIP8,.3 SFM, SIP5,.1,67TB SOP, SOP8,.25 D2PAK-5 SFM, SIP5,.1,67TB D2PAK-5 SOP, SOP8,.25
Contacts 8 3 8 4 3 4 8
Reach Compliance Code compli compli compli compliant compli compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time 6 weeks 1 week 6 weeks 1 week 6 weeks 6 weeks 6 weeks
Amplifier type BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
Maximum average bias current (IIB) 20 µA 20 µA 20 µA 20 µA 20 µA 20 µA 20 µA
Nominal bandwidth (3dB) 180 MHz 180 MHz 180 MHz 180 MHz 180 MHz 180 MHz 180 MHz
Maximum bias current (IIB) at 25C 20 µA 20 µA 20 µA 20 µA 20 µA 20 µA 20 µA
Maximum input offset voltage 100000 µV 100000 µV 100000 µV 100000 µV 100000 µV 100000 µV 100000 µV
JESD-30 code R-PDIP-T8 R-PSFM-T5 R-PDSO-G8 R-PSSO-G5 R-PSFM-T5 R-PSSO-G5 R-PDSO-G8
JESD-609 code e4 e3 e4 e3 e3 e3 e4
Negative supply voltage upper limit -18 V -18 V -18 V -18 V -18 V -18 V -18 V
Nominal Negative Supply Voltage (Vsup) -15 V -15 V -15 V -15 V -15 V -15 V -15 V
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 5 8 5 5 5 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SFM SOP TO-263 SFM TO-263 SOP
Encapsulate equivalent code DIP8,.3 SIP5,.1,67TB SOP8,.25 SMSIP5H,.6,67TB SIP5,.1,67TB SMSIP5H,.6,67TB SOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLANGE MOUNT SMALL OUTLINE SMALL OUTLINE FLANGE MOUNT SMALL OUTLINE SMALL OUTLINE
method of packing TUBE TUBE TUBE TR TUBE TR TUBE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 260 260 NOT SPECIFIED 260 260
power supply +-15 V +-15 V +-15 V +-15 V +-15 V +-15 V +-15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal slew rate 2000 V/us 2000 V/us 2000 V/us 2000 V/us 2000 V/us 2000 V/us 2000 V/us
Maximum slew rate 20 mA 20 mA 20 mA 20 mA 20 mA 20 mA 20 mA
Supply voltage upper limit 18 V 18 V 18 V 18 V 18 V 18 V 18 V
Nominal supply voltage (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V 15 V
surface mount NO NO YES YES NO YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 2.54 mm 1.7 mm 1.27 mm 1.7 mm 1.7 mm 1.7 mm 1.27 mm
Terminal location DUAL SINGLE DUAL SINGLE SINGLE SINGLE DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Samacsys Descripti 250-mA high-speed buffer - see BUF634A for upgraded versi 250-mA high-speed buffer - see BUF634A for upgraded versi 250-mA high-speed buffer - see BUF634A for upgraded versi - TEXAS INSTRUMENTS - BUF634TG3 - AMP, BUFFER, HIGH SPEED, SMD, TO/SOT5 - -
length 9.59 mm - 4.9 mm 10.16 mm - 10.16 mm 4.9 mm
Maximum seat height 5.08 mm - 1.75 mm 5.13 mm - 5.13 mm 1.75 mm
width 7.62 mm - 3.9 mm 8.925 mm - 8.925 mm 3.9 mm
Humidity sensitivity level - - 3 2 - 2 3

BUF634P Similar Products

Part Number Manufacturer Description
BUF634PG4 Texas Instruments(德州仪器) 250mA缓冲放大器
LMH6559MF Texas Instruments(德州仪器) 增益带宽积(GBP):1.75GHz(-3dB) 放大器组数:1 运放类型:Buffer 各通道功耗:- 压摆率(SR):4580 V/us 电源电压:3V ~ 10V, ±1.5V ~ 5V 高速,闭环缓冲器
LMH6559MF Rochester Electronics BUFFER AMPLIFIER, PDSO5, SOT-23, 5 PIN
CLC111AJE Rochester Electronics Buffer Amplifier, 1 Func, BIPolar, PDSO8, PLASTIC, SOIC-8
HFA1412IP Rochester Electronics QUAD BUFFER AMPLIFIER, PDIP14
CLC110AJE Rochester Electronics Buffer Amplifier, 1 Func, BIPolar, PDSO8, PLASTIC, SOIC-8
CLC114AJP Rochester Electronics Buffer Amplifier, 4 Func, BIPolar, PDIP14, PLASTIC, DIP-14
CLC110A8B Rochester Electronics Buffer Amplifier
HFA1110IP Rochester Electronics BUFFER AMPLIFIER, PDIP8
CLC111AIB Rochester Electronics Buffer Amplifier, 1 Func, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8
CLC114A8B Rochester Electronics Buffer Amplifier, 4 Func, BIPolar, CDIP14, CERDIP-14
CLC114AJE-TR13 Rochester Electronics Buffer Amplifier, 4 Func, BIPolar, PDSO14, PLASTIC, SOIC-14
HFA1110IJ Rochester Electronics BUFFER AMPLIFIER, CDIP8
CLC110AIB Rochester Electronics Buffer Amplifier
CLC114A8D Rochester Electronics Buffer Amplifier, 4 Func, BIPolar, CDIP14, SIDE BRAZED, CERDIP-14
[GD32E503 Review] Part 3: Screen Code Analysis
1. Introduction After a long time, I finally took the opportunity to write a review today while my wife and colleagues were having a party. Haha, I have no choice~ 2. Screen program download The envir...
PowerWorld Domestic Chip Exchange
PIC microcontroller key recognition program
I am working on a project, in which I need to write a key program. In the PIC microcontroller, there are six keys in total, and each key must have this function: short press (2s) to add and subtract. ...
yanjianguo Microchip MCU
How capacitive isolation solves key challenges in AC motor drives
Signal and power isolation helps ensure stable operation of AC motor drive systems and protect operators from high voltage hazards. But not all isolation technologies meet all needs, especially when i...
alan000345 TI Technology Forum
The GPRS module uses AT commands to make calls, but there is no sound from the headset
We use ARM to control the GPRS module and use the corresponding AT commands to implement the calling function. After inserting the SIM card, if there is an incoming call or a phone call, it seems to b...
243663934 Embedded System
What books should I read about low-level drivers?
I will start working on it next month. I have never worked on low-level drivers before, so I want to make some preparations in advance. I only know that the development environment is linux+arm, and i...
hailangties Embedded System
Looking for a paper based on 51 single chip digital clock
If you have any, please send me one [email=zhanghongfu006@163.com]zhanghongfu006@163.com[/email] Thank you...
xunmeng123 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2927  1811  1295  615  1205  59  37  27  13  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号