Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
■
■
■
■
■
■
■
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware
block protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
■
■
■
■
■
■
■
128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
Extended Cycling Capability
—Minimum 100,000 block erase cycles
Software
—Supported by Intel’s Advanced Flash
File Managers -- Intel
®
VFM, Intel
®
FDI, etc.
—Code and data storage in the same
memory device
—Robust Power Loss Recovery for Data
Loss Prevention
—Common Flash Interface
—http://www.intel.com/go/flashsw
Standard Surface Mount Packaging
—48-Ball
µBGA*/VFBGA
—64-Ball Easy BGA packages
—48-TSOP package
ETOX™ VIII (0.13
µm)
Flash
Technology
—8, 16, 32 Mbit
ETOX™ VII (0.18
µm)
Flash Technology
—16, 32 Mbit
ETOX™ VI (0.25
µm)
Flash Technology
—8, 16 and 32 Mbit
The Intel
®
Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13
µm
and 0.18
µm
technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel
®
Flash Data Integrator (Intel
®
FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel
®
Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel
®
Flash website:
http://www.intel.com/design/flash.
Order Number: 290645, Revision: 023
May 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
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in nuclear facility applications.
Legal Lines and Disclaimers
Intel may make changes to specifications and product descriptions at any time, without notice.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by
estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at
http://www.intel.com.
*Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation. All Rights Reserved.
May 2005
2
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Contents
1.0
Introduction....................................................................................................................................7
1.1
1.2
2.0
Nomenclature ....................................................................................................................... 7
Conventions .......................................................................................................................... 7
Functional Overview
..................................................................................................................... 8
2.1
2.2
2.3
Product Overview .................................................................................................................8
Block Diagram ......................................................................................................................9
Memory Map ......................................................................................................................... 9
3.0
Package Information
................................................................................................................... 12
3.1
3.2
3.3
mBGA* and VF BGA Package............................................................................................12
TSOP Package ................................................................................................................... 13
Easy BGA Package ............................................................................................................ 14
4.0
Ballout and Signal Descriptions
................................................................................................ 15
4.1
4.2
4.3
48-Lead TSOP Package ..................................................................................................... 15
64-Ball Easy BGA Package ................................................................................................ 18
Signal Descriptions ............................................................................................................. 18
5.0
Maximum Ratings and Operating Conditions...........................................................................
20
5.1
5.2
Absolute Maximum Ratings ................................................................................................ 20
Operating Conditions .......................................................................................................... 20
6.0
Electrical Specifications
............................................................................................................. 22
6.1
6.2
Current Characteristics ....................................................................................................... 22
DC Voltage Characteristics.................................................................................................24
7.0
AC Characteristics
......................................................................................................................25
7.1
7.2
7.3
7.4
7.5
AC Read Characteristics .................................................................................................... 25
AC Write Characteristics..................................................................................................... 29
Erase and Program Timings ............................................................................................... 33
AC I/O Test Conditions ....................................................................................................... 33
Device Capacitance ............................................................................................................ 34
8.0
Power and Reset Specifications
................................................................................................ 35
8.1
8.2
8.3
8.4
8.5
Active Power (Program/Erase/Read).................................................................................. 35
Automatic Power Savings (APS) ........................................................................................ 35
Standby Power ................................................................................................................... 35
Deep Power-Down Mode.................................................................................................... 35
Power and Reset Considerations ....................................................................................... 36
8.5.1 Power-Up/Down Characteristics ............................................................................ 36
8.5.2 RP# Connected to System Reset .......................................................................... 36
8.5.3 VCC, VPP and RP# Transitions ............................................................................ 36
8.5.4 Reset Specifications .............................................................................................. 37
Power Supply Decoupling................................................................................................... 37
8.6
9.0
Device Operations
....................................................................................................................... 39
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
3
Intel® Advanced+ Boot Block Flash Memory (C3)
9.1
Bus Operations ................................................................................................................... 39
9.1.1 Read ...................................................................................................................... 39
9.1.2 Write ...................................................................................................................... 39
9.1.3 Output Disable ....................................................................................................... 39
9.1.4 Standby.................................................................................................................. 40
9.1.5 Reset ..................................................................................................................... 40
10.0 Modes of Operation.....................................................................................................................
41
10.1
Read Mode ......................................................................................................................... 41
10.1.1 Read Array............................................................................................................. 41
10.1.2 Read Identifier ....................................................................................................... 41
10.1.3 CFI Query .............................................................................................................. 42
10.1.4 Read Status Register............................................................................................. 42
10.1.4.1 Clear Status Register............................................................................. 43
Program Mode .................................................................................................................... 43
10.2.1 12-Volt Production Programming........................................................................... 43
10.2.2 Suspending and Resuming Program..................................................................... 44
Erase Mode ........................................................................................................................ 44
10.3.1 Suspending and Resuming Erase ......................................................................... 45
10.2
10.3
11.0 Security Modes
............................................................................................................................ 49
Flexible Block Locking ........................................................................................................ 49
11.1.1 Locking Operation.................................................................................................. 50
11.1.1.1 Locked State .......................................................................................... 50
11.1.1.2 Unlocked State....................................................................................... 50
11.1.1.3 Lock-Down State.................................................................................... 50
11.2 Reading Block-Lock Status................................................................................................. 50
11.3 Locking Operations during Erase Suspend ........................................................................ 51
11.4 Status Register Error Checking .......................................................................................... 51
11.5 128-Bit Protection Register................................................................................................. 51
11.5.1 Reading the Protection Register............................................................................ 52
11.5.2 Programming the Protection Register.................................................................... 52
11.5.3 Locking the Protection Register............................................................................. 52
11.6 V
PP
Program and Erase Voltages ...................................................................................... 52
11.6.1 Program Protection................................................................................................ 53
Write State Machine States.........................................................................................................
54
Flow Charts
.................................................................................................................................. 56
Common Flash Interface.............................................................................................................
62
C.1 Query Structure Output....................................................................................................... 62
C.2 Query Structure Overview .................................................................................................. 63
C.3 Block Status Register ......................................................................................................... 64
C.4 CFI Query Identification String............................................................................................ 65
C.5 Device Geometry Definition ................................................................................................ 66
C.6 Intel-Specific Extended Query Table .................................................................................. 68
Additional Information
................................................................................................................ 70
Ordering Information...................................................................................................................
71
11.1
A
B
C
D
E
May 2005
4
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Revision History
Date of
Revision
05/12/98
Version
-001
Original version
48-Lead TSOP package diagram change
µBGA
package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
I
PPD
test conditions clarification (Section 4.3)
µBGA
package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
V
IH
Specification change (Section 4.3)
V
IL
Maximum Specification change (Section 4.3)
I
CCS
test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from
3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
Added t
BHWH
/t
BHEH
and t
QVBL
(Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart
changed (Appendix B)
Added t
WHGL
(Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max I
CCD
changed to 25 µA
Table 10, added note indicating V
CC
Max = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
10/12/00
-010
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25µm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
7/20/01
-011
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
10/02/01
2/05/02
-012
-013
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Description
07/21/98
-002
10/03/98
-003
12/04/98
12/31/98
02/24/99
-004
-005
-006
06/10/99
-007
03/20/00
04/24/00
-008
-009
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
5
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