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AM1802EZWTD3

Description
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,182 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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AM1802EZWTD3 Overview

Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90

AM1802EZWTD3 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
package instructionLFBGA,
Reach Compliance Codecompli
ECCN code3A991A2
Factory Lead Time6 weeks
Address bus width23
bit size32
boundary scanYES
maximum clock frequency30 MHz
External data bus width16
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B361
JESD-609 codee1
length16 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels80
Number of terminals361
On-chip data RAM width8
Maximum operating temperature90 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
RAM (number of words)172032
Maximum seat height1.4 mm
speed300 MHz
Maximum supply voltage1.32 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width16 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

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Description Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction LFBGA, LFBGA, NFBGA-361 LFBGA, BGA361,19X19,25
Reach Compliance Code compli compli compliant compli
ECCN code 3A991A2 3A991A2 3A001.A.3 3A991.A.2
Factory Lead Time 6 weeks 1 week 1 week 1 week
Address bus width 23 23 - 23
bit size 32 32 32 32
maximum clock frequency 30 MHz 30 MHz 50 MHz 30 MHz
External data bus width 16 16 - 16
JESD-30 code S-PBGA-B361 S-PBGA-B361 S-PBGA-B361 S-PBGA-B361
JESD-609 code e1 e1 e1 e1
length 16 mm 13 mm 16 mm 13 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 361 361 361 361
Maximum operating temperature 90 °C 90 °C 90 °C 90 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260
Maximum seat height 1.4 mm 1.3 mm 1.4 mm 1.3 mm
speed 300 MHz 300 MHz 300 MHz 300 MHz
Maximum supply voltage 1.32 V 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.14 V 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.65 mm 0.8 mm 0.65 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 16 mm 13 mm 16 mm 13 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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