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AM1802BZWTD3

Description
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,182 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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AM1802BZWTD3 Overview

Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90

AM1802BZWTD3 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionNFBGA-361
Contacts361
Reach Compliance Codecompliant
ECCN code3A001.A.3
Factory Lead Time1 week
Has ADCNO
Address bus width
bit size32
maximum clock frequency50 MHz
DAC channelNO
DMA channelYES
External data bus width
JESD-30 codeS-PBGA-B361
JESD-609 codee1
length16 mm
Humidity sensitivity level3
Number of I/O lines144
Number of terminals361
Maximum operating temperature90 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA361,19X19,32
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1.2,1.8,3.3 V
Certification statusNot Qualified
ROM programmabilityFLASH
Maximum seat height1.4 mm
speed300 MHz
Maximum supply voltage1.32 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width16 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1

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Description Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction NFBGA-361 LFBGA, LFBGA, LFBGA, BGA361,19X19,25
Reach Compliance Code compliant compli compli compli
ECCN code 3A001.A.3 3A991A2 3A991A2 3A991.A.2
Factory Lead Time 1 week 1 week 6 weeks 1 week
Address bus width - 23 23 23
bit size 32 32 32 32
maximum clock frequency 50 MHz 30 MHz 30 MHz 30 MHz
External data bus width - 16 16 16
JESD-30 code S-PBGA-B361 S-PBGA-B361 S-PBGA-B361 S-PBGA-B361
JESD-609 code e1 e1 e1 e1
length 16 mm 13 mm 16 mm 13 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 361 361 361 361
Maximum operating temperature 90 °C 90 °C 90 °C 90 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260
Maximum seat height 1.4 mm 1.3 mm 1.4 mm 1.3 mm
speed 300 MHz 300 MHz 300 MHz 300 MHz
Maximum supply voltage 1.32 V 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.14 V 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.65 mm 0.8 mm 0.65 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 16 mm 13 mm 16 mm 13 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROCONTROLLER, RISC

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