|
AM1802BZCED3 |
AM1802EZCED3 |
AM1802EZWTD3 |
AM1802BZWTD3 |
| Description |
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 |
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 |
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 |
Sitara Processor: ARM9, LPDDR, DDR2, Ethernet 361-NFBGA -40 to 90 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
LFBGA, BGA361,19X19,25 |
LFBGA, |
LFBGA, |
NFBGA-361 |
| Reach Compliance Code |
compli |
compli |
compli |
compliant |
| ECCN code |
3A991.A.2 |
3A991A2 |
3A991A2 |
3A001.A.3 |
| Factory Lead Time |
1 week |
1 week |
6 weeks |
1 week |
| Address bus width |
23 |
23 |
23 |
- |
| bit size |
32 |
32 |
32 |
32 |
| maximum clock frequency |
30 MHz |
30 MHz |
30 MHz |
50 MHz |
| External data bus width |
16 |
16 |
16 |
- |
| JESD-30 code |
S-PBGA-B361 |
S-PBGA-B361 |
S-PBGA-B361 |
S-PBGA-B361 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
| length |
13 mm |
13 mm |
16 mm |
16 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
| Number of terminals |
361 |
361 |
361 |
361 |
| Maximum operating temperature |
90 °C |
90 °C |
90 °C |
90 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFBGA |
LFBGA |
LFBGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| Maximum seat height |
1.3 mm |
1.3 mm |
1.4 mm |
1.4 mm |
| speed |
300 MHz |
300 MHz |
300 MHz |
300 MHz |
| Maximum supply voltage |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
| Minimum supply voltage |
1.14 V |
1.14 V |
1.14 V |
1.14 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
0.65 mm |
0.65 mm |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
13 mm |
13 mm |
16 mm |
16 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROCONTROLLER, RISC |