Register StackÃ16 x 4 RAM TRI-STATEE Output Register
| 54F410 | 54F410DM | 54F410LM | 74F410PC | 74F410SC | 74F410 | |
|---|---|---|---|---|---|---|
| Description | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | - |
| Maker | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - |
| package instruction | - | DIP, DIP18,.3 | CERPACK-20 | DIP, DIP18,.3 | SOP, SO20(UNSPEC) | - |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | - |
| ECCN code | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | - |
| Maximum access time | - | 12 ns | 12 ns | 10 ns | 10 ns | - |
| JESD-30 code | - | R-GDIP-T18 | R-GDFP-F20 | R-PDIP-T18 | R-PDSO-G20 | - |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - |
| memory density | - | 64 bi | 64 bi | 64 bi | 64 bi | - |
| Memory IC Type | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - |
| memory width | - | 4 | 4 | 4 | 4 | - |
| Number of functions | - | 1 | 1 | 1 | 1 | - |
| Number of terminals | - | 18 | 20 | 18 | 20 | - |
| word count | - | 16 words | 16 words | 16 words | 16 words | - |
| character code | - | 16 | 16 | 16 | 16 | - |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| Maximum operating temperature | - | 125 °C | 125 °C | 70 °C | 70 °C | - |
| organize | - | 16X4 | 16X4 | 16X4 | 16X4 | - |
| Package body material | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | DIP | DFP | DIP | SOP | - |
| Encapsulate equivalent code | - | DIP18,.3 | LCC20,.35SQ | DIP18,.3 | SO20(UNSPEC) | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | - | IN-LINE | FLATPACK | IN-LINE | SMALL OUTLINE | - |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | - | 5 V | 5 V | 5 V | 5 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | - | 5.08 mm | 2.286 mm | 5.08 mm | 2.65 mm | - |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | - | NO | YES | NO | YES | - |
| technology | - | TTL | TTL | TTL | CMOS | - |
| Temperature level | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | - |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | GULL WING | - |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | - | 7.62 mm | 6.731 mm | 7.62 mm | 7.5 mm | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
Microchip MCU
Embedded System
Talking
Talking
RF/Wirelessly
Microcontroller MCU
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