Register StackÃ16 x 4 RAM TRI-STATEE Output Register
| 74F410 | 54F410 | 54F410DM | 54F410LM | 74F410PC | 74F410SC | |
|---|---|---|---|---|---|---|
| Description | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | - | - | DIP, DIP18,.3 | CERPACK-20 | DIP, DIP18,.3 | SOP, SO20(UNSPEC) |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow |
| ECCN code | - | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
| Maximum access time | - | - | 12 ns | 12 ns | 10 ns | 10 ns |
| JESD-30 code | - | - | R-GDIP-T18 | R-GDFP-F20 | R-PDIP-T18 | R-PDSO-G20 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 |
| memory density | - | - | 64 bi | 64 bi | 64 bi | 64 bi |
| Memory IC Type | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | - | - | 4 | 4 | 4 | 4 |
| Number of functions | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | - | 18 | 20 | 18 | 20 |
| word count | - | - | 16 words | 16 words | 16 words | 16 words |
| character code | - | - | 16 | 16 | 16 | 16 |
| Operating mode | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | - | 125 °C | 125 °C | 70 °C | 70 °C |
| organize | - | - | 16X4 | 16X4 | 16X4 | 16X4 |
| Package body material | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | DIP | DFP | DIP | SOP |
| Encapsulate equivalent code | - | - | DIP18,.3 | LCC20,.35SQ | DIP18,.3 | SO20(UNSPEC) |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | IN-LINE | FLATPACK | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | - | 5 V | 5 V | 5 V | 5 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 5.08 mm | 2.286 mm | 5.08 mm | 2.65 mm |
| Maximum supply voltage (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | NO | YES | NO | YES |
| technology | - | - | TTL | TTL | TTL | CMOS |
| Temperature level | - | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | GULL WING |
| Terminal pitch | - | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | - | 7.62 mm | 6.731 mm | 7.62 mm | 7.5 mm |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 |
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