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HY27US161G1MSCS

Description
Flash, 64MX16, 45ns, PDSO48, 12 X 17 MM, 0.65 MM PITCH, USOP1-48
Categorystorage    storage   
File Size313KB,39 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY27US161G1MSCS Overview

Flash, 64MX16, 45ns, PDSO48, 12 X 17 MM, 0.65 MM PITCH, USOP1-48

HY27US161G1MSCS Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeSOIC
package instructionVSSOP, TSSOP48,.71,20
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time45 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G48
length17 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8K
Number of terminals48
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP48,.71,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
page size256 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height0.65 mm
Department size8K
Maximum standby current0.00005 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeSLC NAND TYPE
width12 mm
Preliminary
HY27US(08/16)1G1M Series
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
1Gb NAND FLASH
HY27US081G1M
HY27US161G1M
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev 0.2 / May. 2007
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