TMS27C010-200JL datasheet, PDF

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TMS27C010-200JL: DescriptionUVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32; Categorystorage storage; File Size1MB，17 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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TMS27C010-200JL Overview

UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32

TMS27C010-200JL Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
Maximum access time	200 ns
JESD-30 code	R-CDIP-T32
length	41.91 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Maximum seat height	4.907 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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TMS27C010-200JL Related Products

	TMS27C010-200JL	TMS27C010-170JL	TMS27C010-25JL	TMS27C010-300JL	TMS27C010-30JL
Description	UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 170ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	200 ns	170 ns	250 ns	300 ns	300 ns
JESD-30 code	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32
length	41.91 mm	41.91 mm	41.91 mm	41.91 mm	41.91 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	4.907 mm	4.907 mm	4.907 mm	4.907 mm	4.907 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.25 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.75 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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