UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32
| Parameter Name | Attribute value |
| Maker | Rochester Electronics |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Maximum access time | 250 ns |
| JESD-30 code | R-CDIP-T32 |
| length | 41.91 mm |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Maximum seat height | 4.907 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |





| TMS27C010-25JL | TMS27C010-170JL | TMS27C010-200JL | TMS27C010-300JL | TMS27C010-30JL | |
|---|---|---|---|---|---|
| Description | UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 170ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 250 ns | 170 ns | 200 ns | 300 ns | 300 ns |
| JESD-30 code | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 |
| length | 41.91 mm | 41.91 mm | 41.91 mm | 41.91 mm | 41.91 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Maximum seat height | 4.907 mm | 4.907 mm | 4.907 mm | 4.907 mm | 4.907 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |