5962-3829406MYA datasheet, PDF

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5962-3829406MYA: DescriptionSRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32; Categorystorage storage; File Size100KB，28 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-3829406MYA Overview

SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32

5962-3829406MYA Parametric

Parameter Name	Attribute value
Parts packaging code	QFJ
package instruction	QCCN, LCC32,.45X.55
Contacts	32
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	65536 bi
Memory IC Type	OTHER SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	3.048 mm
Maximum standby current	0.0003 A
Minimum standby current	2 V
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm
Base Number Matches	1

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IDT

Military Product

Selector Guide

January 1999

Military Overview

Introduction

Since the company’s inception in 1980, IDT has been a dedicated supplier of products for the military market. IDT supplies

communications memories, networking devices, embedded RISC microprocessors, high-speed static random access

memories (SRAMs), specialty memory, and high-performance logic to military contractors.

Qualified Manufacturers List (QML)

MIL-SPECIFICATIONS EVOLVED FROM 1950’s

“Screening quality in” activities were initiated with military electronic procurements in the 1950’s. Qualified Parts List (QPL)

system, administrated by the Defense Electronics Supply Center, DESC, was established to guarantee ICs purchased by

military contractors met strict U.S. Government standards. This process evolved into a system known as JAN (Joint Army-

Navy) as described under standard MIL-M-38510 and MIL-STD-883. The main benefit of MIL-M-38510 at its inception is now

its largest drawback. It attempts to “screen” quality in through a rigid set of tests that manufacturers must complete for each

and every device lot. The tests are rigidly performed regardless of device type, maturity, or manufacturing data showing parts

of qualification process can be dropped without impact on reliability.

SPC & TQM DROVE MILITARY INDUSTRY CHANGE

While the QPL system remained inflexible the semiconductor industry did not. Quality and reliability improvements through

process manufacturing techniques like Statistical Process Control (SPC) allowed semiconductor companies to ensure quality

and reliability in the manufacturing process. This minimized/eliminated test screens previously imposed to screen out defective

products after they have been manufactured.

The government’s support of Total Quality Management (TQM) in the 1980’s was the beginning of a journey that would

lead to more flexible military procurement policies. Applicable to any manufacturing system, TQM performance-based

specifications created a new understanding of quality and reliability assurance.

1994 - PERRY CHANGES MILITARY PROCUREMENT SYSTEM

MIL-PRF-38535/Qualified Manufacturers List (QML) grew out of the 1994 mandate by Secretary of Defense, Dr. William

Perry, to utilize performance standards to purchase components. The aim was to move the defense procurement process

away from a strict, regimented “mil-spec” system towards a system that relied on “best commercial practices”. As part of the

reflection of change DESC was deactivated and its mission realigned as a combined Inventory Control Point (ICP) in

Columbus, Ohio. The ICP is called Defense Supply Center Columbus (DSCC).

QML FOLLOWS BEST COMMERCIAL PRACTICE

QML is a performance-based specification, MIL-PRF-38535. The SMD, JAN, etc. specifications define electrical

performance for a particular device. These devices are built using QML (MIL-PRF-38535) as the process performance

specification. QML allows the elimination of non-valued-added steps via analyzing data gathered from manufacturing and

testing process. When sufficient data proves a particular step is no longer necessary, it is deleted. Reduced screening lowers

cycle times as non-value-added steps are eliminated, reducing the potential introduction of defects from extensive screening

processes.

IDT QML Certification

In June 1998, IDT received Qualified Manufacturers List (QML) certification to produce and supply military products.

The Defense Supply Center, Columbus (DSCC) awarded IDT QML certification based upon IDT superior quality and reliability

standards for product manufacturing and testing. The MIL-PRF-38535 QML specifications allow QML-certified companies to

follow a “best practice” standard for superior quality and reliability in manufacturing and testing. Companies without

certification must comply with older, more stringent criteria – which is redundant, expensive and time-consuming. An IDT

Technical Review Board (TRB) reviews military flows and recommends changes to DSCC. The “C” mark for MIL-STD-883

compliant product has been replaced with a “Q” mark for QML compliant on IDT military products. This change has no effect

on ordering part numbers (IDT Part Numbers, DESC, SMD, drawing, etc.) which remain the same. QML ensures world-class

quality, reduces cycle time and eliminates redundant activities, resulting in higher value and lower costs for our customers.

This will allow IDT to continue offering both existing and new military products to the military market.

STACK Certification

STACK international is an electronic equipment manufacturers’ association that standardizes qualification procedures for

IC’s. IDT was awarded STACK certification to perform self-audit internal quality audits without external audits by STACK. To

receive this award, IDT passed three levels of certification and exceeded STACK standards for quality in IC design,

manufacturing, test and assembly. IDT Oregon, Malaysia, Philippines and California facilities were audited.

5962-3829406MYA Related Products

	5962-3829406MYA	5962-3829410MYA	5962-3829409MYA	5962-3829414MYA
Description	SRAM, 8KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 45ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 55ns, CMOS, CQCC32, CERAMIC, LCC-32	SRAM, 8KX8, 25ns, CMOS, CQCC32, CERAMIC, LCC-32
Parts packaging code	QFJ	QFJ	QFJ	QFJ
package instruction	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	CERAMIC, LCC-32
Contacts	32	32	32	32
Reach Compliance Code	unknow	unknow	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	70 ns	45 ns	55 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0
length	13.97 mm	13.97 mm	13.97 mm	13.97 mm
memory density	65536 bi	65536 bi	65536 bit	65536 bit
Memory IC Type	OTHER SRAM	OTHER SRAM	OTHER SRAM	OTHER SRAM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	32	32	32	32
word count	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	QCCN	QCCN	QCCN
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	3.048 mm	3.048 mm	3.048 mm	3.048 mm
Maximum standby current	0.0003 A	0.0003 A	0.02 A	0.0003 A
Minimum standby current	2 V	2 V	4.5 V	2 V
Maximum slew rate	0.09 mA	0.105 mA	0.125 mA	0.11 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
width	11.43 mm	11.43 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1

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