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THGBMBG6D1KBAIL

Description
FLASH MEMORY DRIVE CONTROLLER, PBGA153
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size258KB,2 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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THGBMBG6D1KBAIL Overview

FLASH MEMORY DRIVE CONTROLLER, PBGA153

THGBMBG6D1KBAIL Parametric

Parameter NameAttribute value
MakerToshiba Semiconductor
package instructionBGA,
Reach Compliance Codeunknown
Maximum host data transfer rate275 MBps
JESD-30 codeR-PBGA-B153
Number of terminals153
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeSECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
FAB_eMMC_1405
NAND FLASH MEMORY
e
•MMC
TM
Cost Effective Mass Storage
e—MMC™
is a family of advanced and highly
efficient NAND flash memory with an integrated
controller and enhanced memory management.
Based on an interface standardized by JEDEC,
Toshiba’s
e—MMC™
offers the optimal solution for
applications where higher data volume needs to be
stored in a cost efficient way. It is fully compliant with
the Multimedia Card Association (MMCA) high speed
memory interface standard.
APPLICATIONS
Industrial Applications
Consumer Electronics
Multimedia Applications
Smart Metering & Intelligent Lighting
FEATURES
ADVANTAGES
BENEFITS
4GByte – 64GByte
19nm and new advanced A19nm
Multi level cell architecture
Conforms to the latest JEDEC
Version 4.5 and 5.0
Integrated memory management
Error correction code
Bad block management
Wear-leveling
Garbage collection
Standard and extended temperature
range
FBGA package
Higher Interface speed according to
JEDEC 5.0
Read Speed up to 275MB/s
Write Speed up to 90MB/s
Managed memory
Package, interface, features,
commands etc. are standard
Utilizing high quality Toshiba MLC
NAND flash memory in combination
with a Toshiba origin developed
controller
Produced in the world’s largest,
leading edge technology flash
factory
Easy to integrate storage
solution due to established
standards
Cost efficient design in
Optimal relation between
price, density and
performance
Reliable storage solution
based on high quality MLC
memory and optimized
controller
Extended production capacity
to fulfil customers demand
SPECIFICATIONS
Product / Features
Density
Technology
JEDEC Version
Temperature
Package
e—MMC™
4GByte – 64GByte
A19nm
5.0
-25°C to +85°C
FBGA
Extended Temp.
e—MMC™
4GByte – 32GByte
19nm
4.5
-40°C to +85°C
www.toshiba-components.com
www.toshiba-components.com

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Description FLASH MEMORY DRIVE CONTROLLER, PBGA153 FLASH MEMORY DRIVE CONTROLLER, PBGA153 FLASH MEMORY DRIVE CONTROLLER, PBGA153 FLASH MEMORY DRIVE CONTROLLER, PBGA153
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
package instruction BGA, BGA, BGA, BGA,
Reach Compliance Code unknown unknown unknown unknown
Maximum host data transfer rate 275 MBps 275 MBps 275 MBps 275 MBps
JESD-30 code R-PBGA-B153 R-PBGA-B153 R-PBGA-B153 R-PBGA-B153
Number of terminals 153 153 153 153
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -40 °C -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level OTHER INDUSTRIAL OTHER OTHER
Terminal form BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
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