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STK12C68-K35IM

Description
8KX8 NON-VOLATILE SRAM, 35ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28
Categorystorage    storage   
File Size62KB,10 Pages
ManufacturerCypress Semiconductor
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STK12C68-K35IM Overview

8KX8 NON-VOLATILE SRAM, 35ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28

STK12C68-K35IM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP28,.3
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeR-CDIP-T28
JESD-609 codee0
length35.56 mm
memory density65536 bit
Memory IC TypeNON-VOLATILE SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height4.14 mm
Maximum standby current0.003 A
Maximum slew rate0.085 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.62 mm
STK12C68-IM
STK12C68-IM
CMOS nvSRAM
8K x 8
AutoStore™
Nonvolatile Static RAM
Industrial Temperature/Military Screen
FEATURES
• Industrial Temperature with Military Screening
• 25, 35 and 45ns Access Times
• 15 mA I
CC
at 200ns Access Speed
• Automatic
STORE
to
EEPROM
on Power Down
• Hardware or Software initiated
STORE
to
EEPROM
DESCRIPTION
The Simtek STK12C68-IM is a fast static
RAM
(25, 35
and 45ns), with a nonvolatile
EEPROM
element incor-
porated in each static memory cell. The
SRAM
can be
read and written an unlimited number of times, while
independent nonvolatile data resides in
EEPROM
. Data
transfers from the
SRAM
to the
EEPROM
(
the
STORE
operation
) take place automatically upon power down
using charge stored in an external 100
µF
capacitor.
Transfers from the
EEPROM
to the
SRAM
(the
RECALL
operation) take place automatically on power up. Soft-
ware sequences may also be used to initiate both
STORE
and
RECALL
operations. A
STORE
can also be
initiated via a single pin.
The STK12C68-IM is available in the following
packages: a 28-pin 300 mil ceramic DIP and a 28-pad
LCC. MIL-STD-883 and Standard Military Drawing
(SMD 5962-94599) devices are also available.
• Automatic
STORE
Timing
• 100,000
STORE
cycles to
EEPROM
• 10 year data retention in
EEPROM
• Automatic
RECALL
on Power Up
• Software initiated
RECALL
from
EEPROM
• Unlimited
RECALL
cycles from
EEPROM
• Single 5V
±
10% Operation
• Commercial and Industrial Temperatures
• Available in multiple standard packages
LOGIC BLOCK DIAGRAM
PIN CONFIGURATIONS
V
CAP
V
CAP
V
CCX
A
7
A
12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CCX
W
HSB
A
8
A
9
A
11
G
A
10
E
DQ
7
DQ
6
DQ
5
DQ
4
DQ
3
EEPROM ARRAY
256 x 256
A
3
A
4
ROW DECODER
A
6
A
5
4
5
6
7
8
9
10
11
12
W
A
12
A
7
A
6
HSB
A
8
A
9
A
11
G
A
10
E
DQ
7
DQ
6
3
2
1
28 27
26
25
24
23
STORE
STATIC RAM
ARRAY
256 x 256
A
0
A
12
A
4
A
3
A
2
A
1
A
0
DQ
0
DQ
1
A
5
A
4
A
3
A
2
A
1
A
0
DQ
0
DQ
1
DQ
2
V
SS
A
5
A
6
A
7
A
8
A
9
A
12
DQ
0
DQ
1
DQ
2
DQ
3
DQ
4
DQ
5
DQ
6
DQ
7
RECALL
TOP VIEW
22
21
20
19
18
13 14 15 16 17
DQ
2
DQ
3
DQ
4
STORE/
RECALL
CONTROL
HSB
28 - LCC
DQ
5
Vss
28 - 300 CDIP
COLUMN I/O
PIN NAMES
A
0
- A
12
Address Inputs
Write Enable
Data In/Out
Chip Enable
Output Enable
Power (+5V)
Ground
Capacitor
Hardware Store/Busy
W
DQ
0
- DQ
7
E
INPUT BUFFERS
COLUMN DECODER
A
0
A
1
A
2
A
10
A
11
G
G
V
CCX
V
SS
E
W
V
CAP
HSB
41

STK12C68-K35IM Related Products

STK12C68-K35IM STK12C68-C45IM STK12C68-K45IM STK12C68-C25IM STK12C68-C35IM STK12C68-L45IM STK12C68-K25IM STK12C68-L25IM
Description 8KX8 NON-VOLATILE SRAM, 35ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 45ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 45ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 35ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 45ns, CQCC28, CERAMIC, LCC-28 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 25ns, CQCC28, CERAMIC, LCC-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP QLCC DIP QLCC
package instruction DIP, DIP28,.3 DIP, DIP28,.3 DIP, DIP28,.3 DIP, DIP28,.3 DIP, DIP28,.3 QCCN, LCC28,.35X.55 DIP, DIP28,.3 QCCN, LCC28,.35X.55
Contacts 28 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 35 ns 45 ns 45 ns 25 ns 35 ns 45 ns 25 ns 25 ns
JESD-30 code R-CDIP-T28 R-CDIP-T28 R-CDIP-T28 R-CDIP-T28 R-CDIP-T28 R-CQCC-N28 R-CDIP-T28 R-CQCC-N28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 35.56 mm 35.56 mm 35.56 mm 35.56 mm 35.56 mm 13.97 mm 35.56 mm 13.97 mm
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP QCCN DIP QCCN
Encapsulate equivalent code DIP28,.3 DIP28,.3 DIP28,.3 DIP28,.3 DIP28,.3 LCC28,.35X.55 DIP28,.3 LCC28,.35X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 NOT SPECIFIED 240 NOT APPLICABLE NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.14 mm 4.14 mm 4.14 mm 4.14 mm 4.14 mm 2.29 mm 4.14 mm 2.29 mm
Maximum standby current 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A
Maximum slew rate 0.085 mA 0.08 mA 0.08 mA 0.095 mA 0.085 mA 0.08 mA 0.095 mA 0.095 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL QUAD DUAL QUAD
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 NOT APPLICABLE NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 8.89 mm 7.62 mm 8.89 mm
Maker Cypress Semiconductor - Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor

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