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M36W0R6040B0ZAQE

Description
Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
Categorystorage    storage   
File Size347KB,18 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Download Datasheet Parametric Compare View All

M36W0R6040B0ZAQE Overview

Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88

M36W0R6040B0ZAQE Parametric

Parameter NameAttribute value
MakerNumonyx ( Micron )
Parts packaging codeBGA
package instructionTFBGA,
Contacts88
Reach Compliance Codeunknown
Other featuresPSRAM IS ORGANIZED AS 1M X 16
JESD-30 codeR-PBGA-B88
JESD-609 codee1
length10 mm
memory density67108864 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals88
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
M36W0R6040T0
M36W0R6040B0
64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory
and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package
FEATURES SUMMARY
MULTI-CHIP PACKAGE
– 1 die of 64 Mbit (4Mb x 16) Flash Memory
– 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM
SUPPLY VOLTAGE
– V
DDF
= V
DDP
= V
DDQ
= 1.7V to 1.95V
LOW POWER CONSUMPTION
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code (Top Flash Configuration),
M36W0R6040T0: 8810h
– Device Code (Bottom Flash
Configuration), M36W0R6040B0: 8811h
PACKAGES
– Compliant with Lead-Free Soldering
Processes
– Lead-Free Versions
Figure 1. Package
FBGA
Stacked TFBGA88 (ZA)
8 x 10mm
FLASH MEMORY
PROGRAMMING TIME
– 8µs by Word typical for Fast Factory
Program
– Double/Quadruple Word Program option
– Enhanced Factory Program options
MEMORY BLOCKS
– Multiple Bank Memory Array: 4 Mbit
Banks
– Parameter Blocks (Top location)
SYNCHRONOUS / ASYNCHRONOUS READ
– Synchronous Burst Read mode: 66MHz
– Asynchronous/ Synchronous Page Read
mode
– Random Access: 70ns
DUAL OPERATIONS
– Program Erase in one Bank while Read in
others
– No delay between Read and Write
operations
BLOCK LOCKING
– All blocks locked at Power-up
– Any combination of blocks can be locked
– WP
F
for Block Lock-Down
SECURITY
– 128-bit user programmable OTP cells
– 64-bit unique device number
COMMON FLASH INTERFACE (CFI)
100,000 PROGRAM/ERASE CYCLES per
BLOCK
PSRAM
ACCESS TIME: 70ns
LOW STANDBY CURRENT: 110µA
DEEP POWER DOWN CURRENT: 10µA
December 2004
1/18

M36W0R6040B0ZAQE Related Products

M36W0R6040B0ZAQE M36W0R6040T0ZAQE M36W0R6040T0ZAQT M36W0R6040T0ZAQ M36W0R6040T0ZAQF M36W0R6040B0ZAQT
Description Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88
Maker Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction TFBGA, TFBGA, TFBGA, TFBGA, TFBGA, TFBGA,
Contacts 88 88 88 88 88 88
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Other features PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 1M X 16
JESD-30 code R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88
JESD-609 code e1 e1 e0 e0 e1 e0
length 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of terminals 88 88 88 88 88 88
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -30 °C -30 °C -30 °C -30 °C -30 °C -30 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD TIN SILVER COPPER TIN LEAD
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm

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