UM3008
N-Ch 30V Fast Switching MOSFETs
General Description
The UM3008 is the highest performance trench
N-ch MOSFETs with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the synchronous buck converter
applications .
The UM3008 meet the RoHS and Green Product
requirement with full function reliability approved.
Product Summery
BV
DSS
30V
Applications
R
DS(ON)
25mΩ
ID
6.2A
High Frequency Point-of-Load Synchronous s
Small power switching for MB/NB/UMPC/VGA
Networking DC-DC Power System
Features
Advanced high cell density Trench technology
Super Low Gate Charge
Excellent Cdv/dt effect decline
Green Device Available
Load Switch
SOP8 Pin Configuration
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
A
=25℃
I
D
@T
A
=70℃
I
DM
EAS
I
AS
P
D
@T
A
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
2
Single Pulse Avalanche Energy
Avalanche Current
Total Power Dissipation
4
Storage Temperature Range
Operating Junction Temperature Range
3
1
Rating
30
±20
6.2
5
25
26.6
12.7
1.5
-55 to 150
-55 to 150
Units
V
V
A
A
A
mJ
A
W
℃
℃
Continuous Drain Current, V
GS
@ 10V
1
Thermal Data
Symbol
R
θJA
R
θJC
Parameter
Thermal Resistance Junction-ambient
1
Thermal Resistance Junction-Case
1
Typ.
---
---
Max.
85
25
Unit
℃/W
℃/W
1
UM3008
N-Ch 30V Fast Switching MOSFETs
Electrical Characteristics (T
J
=25
℃,
unless otherwise noted)
Symbol
BV
DSS
Parameter
Drain-Source Breakdown Voltage
Conditions
V
GS
=0V , I
D
=250uA
Reference to 25℃ , I
D
=1mA
V
GS
=10V , I
D
=6A
V
GS
=4.5V , I
D
=5A
V
GS
=V
DS
, I
D
=250uA
V
DS
=24V , V
GS
=0V , T
J
=25℃
V
DS
=24V , V
GS
=0V , T
J
=55℃
V
GS
=±20V
, V
DS
=0V
V
DS
=5V , I
D
=6A
V
DS
=0V , V
GS
=0V , f=1MHz
V
DS
=15V , V
GS
=4.5V , I
D
=6A
Min.
30
---
---
---
1.0
---
---
---
---
---
---
---
---
---
---
V
DD
=15V , V
GS
=10V , R
G
=3.3Ω
I
D
=6A
---
---
---
---
V
DS
=15V , V
GS
=0V , f=1MHz
---
---
Typ.
---
0.023
20
30
1.5
-4.2
---
---
---
5.6
2.3
4.9
1.5
1.85
2.2
38.6
12.4
4.8
416
62
51
Max.
---
---
25
38
2.5
---
1
5
±100
---
4.6
6.9
2.1
2.6
4.4
69
24.8
9.6
582
87
71
pF
ns
nC
Unit
V
V/℃
mΩ
V
mV/℃
uA
nA
S
Ω
△BV
DSS
/△T
J
BVDSS Temperature Coefficient
R
DS(ON)
V
GS(th)
△V
GS(th)
I
DSS
I
GSS
gfs
R
g
Q
g
Q
gs
Q
gd
T
d(on)
T
r
T
d(off)
T
f
C
iss
C
oss
C
rss
Static Drain-Source On-Resistance
2
Gate Threshold Voltage
V
GS(th)
Temperature Coefficient
Drain-Source Leakage Current
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Single Pulse Avalanche Energy
5
Conditions
V
DD
=25V , L=0.1mH , I
AS
=6A
Min.
6
Typ.
---
Max.
---
Unit
mJ
Diode Characteristics
Symbol
I
S
I
SM
V
SD
t
rr
Q
rr
Parameter
Continuous Source Current
1,6
Pulsed Source Current
2,6
Diode Forward Voltage
2
Conditions
V
G
=V
D
=0V , Force Current
V
GS
=0V , I
S
=1A , T
J
=25℃
I
F
=6A , dI/dt=100A/µs , T
J
=25℃
Min.
---
---
---
---
---
Typ.
---
---
---
7.8
2.1
Max.
6.2
25
1.2
---
---
Unit
A
A
V
nS
nC
Reverse Recovery Time
Reverse Recovery Charge
Note :
2
1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=12.7A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
2
UM3008
N-Ch 30V Fast Switching MOSFETs
Typical Characteristics
25
65
I
D
=6A
V
GS
=10V
20
I
D
Drain Current (A)
V
GS
=7V
15
V
GS
=4.5V
V
GS
=3V
10
5
0
0
0.5
1
1.5
2
2.5
R
DSON
(mΩ)
V
GS
=5V
50
35
20
2
4
V
DS
, Drain-to-Source Voltage (V)
V
GS
(V)
6
8
10
Fig.1 Typical Output Characteristics
6
Fig.2 On-Resistance vs. Gate-Source
I
S
Source Current(A)
4
2
T
J
=150℃
T
J
=25℃
0
0.00
0.25
0.50
0.75
1.00
V
SD
, Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
1.8
Fig.4 Gate-Charge Characteristics
1.8
1.4
1
0.6
0.2
-50
0
50
100
150
Normalized On Resistance
1.4
Normalized V
GS(th)
1.0
0.6
0.2
-50
0
50
100
150
T
J
,Junction Temperature (℃ )
T
J
, Junction Temperature (℃)
Fig.5 Normalized V
GS(th)
vs. T
J
Fig.6 Normalized R
DSON
vs. T
J
3
UM3008
N-Ch 30V Fast Switching MOSFETs
1000
100.00
F=1.0MHz
Ciss
Capacitance (pF)
10.00
100us
1ms
10ms
100ms
100
Coss
Crss
I
D
(A)
1.00
0.10
T
A
=25 C
Single Pulse
10
1
5
9
13
17
21
25
o
DC
V
DS
Drain to Source Voltage (V)
0.01
0.01
0.1
V
DS
(V)
1
10
100
Fig.7 Capacitance
1
Fig.8 Safe Operating Area
Normalized Thermal Response (R
θJA
)
DUTY=0.5
0.2
0.1
0.1
0.05
0.01
0.01
P
DM
T
ON
T
SINGLE
0.001
0.0001
0.001
0.01
0.1
1
10
D = T
ON
/T
T
Jpeak
= T
A
+P
DM
XR
θJA
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
Fig.11 Unclamped Inductive Switching Waveform
4
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