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HD74AC138AFPEL

Description
1-of-8 Decoder/Demultiplexer
Categorylogic    logic   
File Size150KB,12 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HD74AC138AFPEL Overview

1-of-8 Decoder/Demultiplexer

HD74AC138AFPEL Parametric

Parameter NameAttribute value
Parts packaging codeSOIC
package instructionSOP, SOP16,.3
Contacts16
Reach Compliance Codecompli
ECCN codeEAR99
JESD-30 codeR-PDSO-G16
Load capacitance (CL)50 pF
Logic integrated circuit typeOTHER DECODER/DRIVER
MaximumI(ol)0.012 A
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
power supply3.3/5 V
Prop。Delay @ Nom-Su15 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website:
http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to
http://www.renesas.com/inquiry.

HD74AC138AFPEL Related Products

HD74AC138AFPEL HD74AC138AP HD74AC138_15 HD74AC138ARPEL HD74AC138TELL
Description 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer
Parts packaging code SOIC DIP - SOIC TSSOP
package instruction SOP, SOP16,.3 DIP, DIP16,.3 - SOP, SOP16,.25 -
Contacts 16 16 - 16 16
Reach Compliance Code compli compli - unknow unknown
ECCN code EAR99 EAR99 - EAR99 EAR99
JESD-30 code R-PDSO-G16 R-PDIP-T16 - R-PDSO-G16 R-PDSO-G16
Load capacitance (CL) 50 pF 50 pF - 50 pF 50 pF
Logic integrated circuit type OTHER DECODER/DRIVER OTHER DECODER/DRIVER - OTHER DECODER/DRIVER OTHER DECODER/DRIVER
MaximumI(ol) 0.012 A 0.012 A - 0.012 A 0.012 A
Number of functions 1 1 - 1 1
Number of terminals 16 16 - 16 16
Maximum operating temperature 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP - SOP TSSOP
Encapsulate equivalent code SOP16,.3 DIP16,.3 - SOP16,.25 TSSOP16,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL - - TAPE AND REEL TAPE AND REEL
power supply 3.3/5 V 3.3/5 V - 3.3/5 V 3.3/5 V
Prop。Delay @ Nom-Su 15 ns 15 ns - 15 ns -
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
surface mount YES NO - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE - GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm - 1.27 mm 0.635 mm
Terminal location DUAL DUAL - DUAL DUAL
Maker - Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
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