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HD74AC138_15

Description
1-of-8 Decoder/Demultiplexer
File Size150KB,12 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HD74AC138_15 Overview

1-of-8 Decoder/Demultiplexer

To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website:
http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to
http://www.renesas.com/inquiry.

HD74AC138_15 Related Products

HD74AC138_15 HD74AC138AFPEL HD74AC138AP HD74AC138ARPEL HD74AC138TELL
Description 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer 1-of-8 Decoder/Demultiplexer
Parts packaging code - SOIC DIP SOIC TSSOP
package instruction - SOP, SOP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 -
Contacts - 16 16 16 16
Reach Compliance Code - compli compli unknow unknown
ECCN code - EAR99 EAR99 EAR99 EAR99
JESD-30 code - R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16
Load capacitance (CL) - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
MaximumI(ol) - 0.012 A 0.012 A 0.012 A 0.012 A
Number of functions - 1 1 1 1
Number of terminals - 16 16 16 16
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP DIP SOP TSSOP
Encapsulate equivalent code - SOP16,.3 DIP16,.3 SOP16,.25 TSSOP16,.25
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL - TAPE AND REEL TAPE AND REEL
power supply - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Prop。Delay @ Nom-Su - 15 ns 15 ns 15 ns -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
surface mount - YES NO YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch - 1.27 mm 2.54 mm 1.27 mm 0.635 mm
Terminal location - DUAL DUAL DUAL DUAL
Maker - - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
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