DATA SHEET
SEMICONDUCTOR
BZT52Bxx Series
SOD-123 Plastic-Encapsulate Zener Diode
Features
Low Zener Impedance
Power Dissipation of 350mW
High Stability and High Reliability
Mechanical Data
Flat Lead SOD-123 Small Outline Plastic Package
Polarity: Color band denotes cathode end
Mounting Position: Any
SOD-123
H
Maximum Ratings & Thermal Characteristics
(
Ratings at 25℃ ambient temperature unless otherwise specified.)
Parameters
Power Dissipation
Forward Voltage @IF=10mA
Storage temperature range
1)
2)
3)
Symbol
Pd
Vf
Ts
Value
350
0.9
1)
2)
Unit
mW
V
℃
-65-+150
Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm²
Short duration test pulse used to minimize self-heating effect
f=1KHz
Maximum Zener
Impedance
Zzk
Zzt
Izk
@Izk
@Izt
Ω
mA
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Reverse Current
IR
uA
50
20
10
5
5
3
3
3
2
1
3
2
1
0.7
0.5
0.2
0.1
0.1
0.1
VR
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
Typical
Temperature
coefficent @
IZTC=mV/℃
Min
Max
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
Electrical Characteristics
(
Ratings at 25℃ ambient temperature unless otherwise specified).
Zener Voltage Range
Device
Marking
Nom(V)
BZT52B2V4
BZT52B2V7
BZT52B3V0
BZT52B3V3
BZT52B3V6
BZT52B3V9
BZT52B4V3
BZT52B4V7
BZT52B5V1
BZT52B5V6
BZT52B6V2
BZT52B6V8
BZT52B7V5
BZT52B8V2
BZT52B9V1
BZT52B10
BZT52B11
BZT52B12
BZT52B13
2WX
2W1
2W2
2W3
2W4
2W5
2W6
2W7
2W8
2W9
2WA
2WB
2WC
2WD
2WE
2WF
2WG
2WH
2WI
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
Vz@Izt
Min(V)
2.35
2.65
2.94
3.23
3.53
3.82
4.21
4.61
5.00
5.49
6.08
6.66
7.35
8.04
8.92
9.80
10.78
11.76
12.74
Max(V)
2.45
2.75
3.06
3.37
3.67
3.98
4.39
4.79
5.20
5.71
6.32
6.94
7.65
8.36
9.28
10.20
11.22
12.24
13.26
Izt
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Test
Current
IZTC
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
http://www.yeashin.com
1
REV.02 20140214
PACKAGE OUTLINE & DIMENSIONS
BZT52Bxx Series
SOD-123 PACKAGE OUTLINE
Plastic surface mounted package
θ
θ
Precautions: PCB Design
Recommended land dimensions for SOD-123 diode. Electrode patterns for PCBs
3.24
技术要求:
中心距:
脚
½:
长:
焊盘½:
脚
焊盘长:
3.24
0.55
1.00
0.50
0.80
1,
塑封½尺寸:
2.70 X 1.60
2:
未注公差为:
±0.05
3,
所有单½:
mm
1.0
0.8
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3
REV.02 20140214
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