Pad Layouts Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each 0805 device.
Pad Dimensions
Device
All 0805 Series
A
Nominal
1.20
B
Nominal
1.00
C
Nominal
1.50
Dimensions : Millimetres
Profile Feature
Average Ramp-Up Rate (T
s
maximum to T
p
)
Preheat:
Temperature Minimum (T
s
minimum)
Temperature Maximum (T
s
maximum)
Time (t
s
minimum to t
s
maximum)
Time maintained above:
Temperature (T
L
)
Time (t
L
)
Peak/Classification Temperature (T
p
):
Time within 5°C of actual Peak:
Temperature (t
p
)
Ramp-Down Rate:
Time 25°C to Peak Temperature:
Pb-Free Assembly
3°C/second maximum
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second maximum
8 minutes maximum
Note 1: All temperatures refer to of the package, measured on the package body surface.
Solder reflow
Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment : < 30°C/60% RH.
Caution:
1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side of the board.
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Page <3>
17/05/11 V1.1
Surface Mountable PTC
Resettable Fuse
Reflow Profile
Temperature
Time
Part Number Table
Description
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Part Number
MC36206
MC36210
MC36213
MC36215
MC36220
Disclaimer
This data sheet and its contents (the "Information") belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes
in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied.
The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data
sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage
resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded.
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