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TSC427EPA

Description
Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size170KB,4 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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TSC427EPA Overview

Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8

TSC427EPA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeDIP
package instruction0.300 INCH, PLASTIC, DIP-8
Contacts8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time1 week
high side driverNO
Interface integrated circuit typeBUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.375 mm
Number of functions2
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output peak current1.5 A
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply4.5/18 V
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum supply voltage18 V
Minimum supply voltage4.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Disconnect time0.06 µs
connection time0.12 µs
width7.62 mm

TSC427EPA Related Products

TSC427EPA TSC427CBA-T TSC426EJA TSC426EPA TSC427C/D TSC427EBA-T TSC427EJA TSC428C/D
Description Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP SOIC DIP DIP DIE SOIC DIP DIE
package instruction 0.300 INCH, PLASTIC, DIP-8 SOP, SOP8,.25 DIP, DIP8,.3 DIP, DIP8,.3 DIE-6 SOP, SOP8,.25 0.300 INCH, CERAMIC, DIP-8 DIE-6
Contacts 8 8 8 8 6 8 8 6
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
high side driver NO NO NO NO NO NO NO NO
Interface integrated circuit type BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code R-PDIP-T8 R-PDSO-G8 R-CDIP-T8 R-PDIP-T8 S-XUUC-N6 R-PDSO-G8 R-CDIP-T8 S-XUUC-N6
Number of functions 2 2 2 2 2 2 2 2
Number of terminals 8 8 8 8 6 8 8 6
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -40 °C -40 °C - -40 °C -40 °C -
Nominal output peak current 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
encapsulated code DIP SOP DIP DIP DIE SOP DIP DIE
Encapsulate equivalent code DIP8,.3 SOP8,.25 DIP8,.3 DIP8,.3 DIE OR CHIP SOP8,.25 DIP8,.3 DIE OR CHIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE UNCASED CHIP SMALL OUTLINE IN-LINE UNCASED CHIP
Peak Reflow Temperature (Celsius) NOT SPECIFIED 245 245 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
surface mount NO YES NO NO YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE NO LEAD GULL WING THROUGH-HOLE NO LEAD
Terminal location DUAL DUAL DUAL DUAL UPPER DUAL DUAL UPPER
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Disconnect time 0.06 µs 0.06 µs 0.06 µs 0.06 µs 0.06 µs 0.06 µs 0.06 µs 0.06 µs
connection time 0.12 µs 0.12 µs 0.12 µs 0.12 µs 0.12 µs 0.12 µs 0.12 µs 0.12 µs
Maker Maxim - Maxim Maxim Maxim Maxim Maxim Maxim
JESD-609 code e0 e0 e0 e0 - e0 e0 -
Maximum seat height 4.572 mm 1.75 mm 5.08 mm 4.572 mm - 1.75 mm 5.08 mm -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm - 1.27 mm 2.54 mm -
width 7.62 mm 3.9 mm 7.62 mm 7.62 mm - 3.9 mm 7.62 mm -
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