Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIE |
| package instruction | DIE-6 |
| Contacts | 6 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| high side driver | NO |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | S-XUUC-N6 |
| Number of functions | 2 |
| Number of terminals | 6 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Nominal output peak current | 1.5 A |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Encapsulate equivalent code | DIE OR CHIP |
| Package shape | SQUARE |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 4.5/18 V |
| Certification status | Not Qualified |
| Maximum supply voltage | 18 V |
| Minimum supply voltage | 4.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Disconnect time | 0.06 µs |
| connection time | 0.12 µs |
| TSC428C/D | TSC427CBA-T | TSC426EJA | TSC426EPA | TSC427C/D | TSC427EBA-T | TSC427EJA | TSC427EPA | |
|---|---|---|---|---|---|---|---|---|
| Description | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIE | SOIC | DIP | DIP | DIE | SOIC | DIP | DIP |
| package instruction | DIE-6 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIE-6 | SOP, SOP8,.25 | 0.300 INCH, CERAMIC, DIP-8 | 0.300 INCH, PLASTIC, DIP-8 |
| Contacts | 6 | 8 | 8 | 8 | 6 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| high side driver | NO | NO | NO | NO | NO | NO | NO | NO |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | S-XUUC-N6 | R-PDSO-G8 | R-CDIP-T8 | R-PDIP-T8 | S-XUUC-N6 | R-PDSO-G8 | R-CDIP-T8 | R-PDIP-T8 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 6 | 8 | 8 | 8 | 6 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| Nominal output peak current | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIE | SOP | DIP | DIP | DIE | SOP | DIP | DIP |
| Encapsulate equivalent code | DIE OR CHIP | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIE OR CHIP | SOP8,.25 | DIP8,.3 | DIP8,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | SMALL OUTLINE | IN-LINE | IN-LINE | UNCASED CHIP | SMALL OUTLINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 245 | 245 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| surface mount | YES | YES | NO | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Disconnect time | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs |
| connection time | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs |
| Maker | Maxim | - | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim |
| JESD-609 code | - | e0 | e0 | e0 | - | e0 | e0 | e0 |
| Maximum seat height | - | 1.75 mm | 5.08 mm | 4.572 mm | - | 1.75 mm | 5.08 mm | 4.572 mm |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal pitch | - | 1.27 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm |
| width | - | 3.9 mm | 7.62 mm | 7.62 mm | - | 3.9 mm | 7.62 mm | 7.62 mm |