DM74S571V datasheet, PDF - EEWORLD Datasheet

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DM74S571V: DescriptionIC 512 X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM; Categorystorage storage; File Size117KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S571V Overview

IC 512 X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM

DM74S571V Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QLCC
package instruction	QCCJ, LDCC20,.4SQ
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	S-PQCC-J20
JESD-609 code	e0
length	8.89 mm
memory density	2048 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	20
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC20,.4SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

DM74S571V Related Products

	DM74S571V	DM74S571AJ	DM74S571AN	DM74S571BN	DM74S571AV	DM74S571BV	DM74S571N	DM74S571BJ	DM74S571J
Description	IC 512 X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	512X4 OTPROM, 45ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 45ns, PDIP16, PLASTIC, DIP-16	512X4 OTPROM, 35ns, PDIP16, PLASTIC, DIP-16	512X4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20	512X4 OTPROM, 55ns, PDIP16, PLASTIC, DIP-16	512X4 OTPROM, 35ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 55ns, CDIP16, CERAMIC, DIP-16
Parts packaging code	QLCC	DIP	DIP	DIP	QLCC	QLCC	DIP	DIP	DIP
package instruction	QCCJ, LDCC20,.4SQ	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Contacts	20	16	16	16	20	20	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	45 ns	45 ns	35 ns	45 ns	35 ns	55 ns	35 ns	55 ns
JESD-30 code	S-PQCC-J20	R-GDIP-T16	R-PDIP-T16	R-PDIP-T16	S-PQCC-J20	S-PQCC-J20	R-PDIP-T16	R-GDIP-T16	R-GDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	8.89 mm	19.43 mm	21.755 mm	21.755 mm	8.89 mm	8.89 mm	21.755 mm	19.43 mm	19.43 mm
memory density	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	20	16	16	16	20	20	16	16	16
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512X4	512X4	512X4	512X4	512X4	512X4	512X4	512X4	512X4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCJ	DIP	DIP	DIP	QCCJ	QCCJ	DIP	DIP	DIP
Encapsulate equivalent code	LDCC20,.4SQ	DIP16,.3	DIP16,.3	DIP16,.3	LDCC20,.4SQ	LDCC20,.4SQ	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm	5.08 mm	5.08 mm	5.08 mm
Maximum slew rate	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	YES	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL
width	8.89 mm	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm	7.62 mm	7.62 mm	7.62 mm
Maker	Texas Instruments	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible

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