EEWORLDEEWORLDEEWORLD

Part Number

Search

HC6216KSHCC

Description
Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24
Categorystorage    storage   
File Size492KB,14 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
Download Datasheet Parametric Compare View All

HC6216KSHCC Overview

Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24

HC6216KSHCC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1400450825
Parts packaging codeDFP
package instructionDFP, FL24,.4
Contacts24
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
YTEOL0
Maximum access time100 ns
Other featuresRADIATION-HARDENED SRAM
I/O typeCOMMON
JESD-30 codeR-CDFP-F24
JESD-609 codee0
length15.1384 mm
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter level38535V;38534K;883S
Maximum seat height3.175 mm
Maximum standby current0.00009 A
Minimum standby current2.5 V
Maximum slew rate0.007 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
total dose1M Rad(Si) V
width10.16 mm

HC6216KSHCC Related Products

HC6216KSHCC HC6216KCH-T HC6216JCH-C HC6216JCH-T HC6216JSHCC HC6216JSHCT HC6216KSHCT
Description Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24
Parts packaging code DFP DFP DIP DIP DIP DIP DFP
package instruction DFP, FL24,.4 DFP, DIP, DIP, DIP, DIP24,.6 DIP, DIP24,.6 DFP, FL24,.4
Contacts 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns
Other features RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM
JESD-30 code R-CDFP-F24 R-CDFP-F24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDFP-F24
length 15.1384 mm 15.1384 mm 30.48 mm 30.48 mm 30.48 mm 30.48 mm 15.1384 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Exportable YES YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DFP DFP DIP DIP DIP DIP DFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.175 mm 3.175 mm 4.318 mm 4.318 mm 4.318 mm 4.318 mm 3.175 mm
Minimum standby current 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 10.16 mm
Is it lead-free? Contains lead - - - Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible - - - incompatible incompatible incompatible
I/O type COMMON - - - COMMON COMMON COMMON
JESD-609 code e0 - - - e0 e0 e0
Output characteristics 3-STATE - - - 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code FL24,.4 - - - DIP24,.6 DIP24,.6 FL24,.4
Filter level 38535V;38534K;883S - - - 38535V;38534K;883S 38535V;38534K;883S 38535V;38534K;883S
Maximum standby current 0.00009 A - - - 0.00009 A 0.00009 A 0.00009 A
Maximum slew rate 0.007 mA - - - 0.007 mA 0.007 mA 0.007 mA
Terminal surface TIN LEAD - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
total dose 1M Rad(Si) V - - - 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V
Maker - Honeywell - Honeywell Honeywell Honeywell Honeywell
How to customize Windows Mobile 5.0 system
I want to make a windows mobile 5.0 system. Does it also use PB?? Why I made a mobile handheld.. The interface is the same as WINCE! It's so ugly!...
joalin Embedded System
What qualifications does a company that develops hardware for banking need? Does the hardware need to pass any certification?
If you want to develop a product like a keyboard with a card swiping function for use at POS machines at bank counters, what other requirements are there besides making the product? For example, what ...
littleshrimp Integrated technical exchanges
AVR microcontroller C language library
AVR microcontroller C language library, you can download it and have a look...
jjkwz MCU
What is the address of the Texas Instruments 2015 China Educator Tour Lecture in Shanghai on May 7?
What is the address of the Texas Instruments 2015 China Educator Tour Lecture in Shanghai on May 7? I received the phone call but not the email. Is there something wrong with my email again? Does anyo...
cl17726 Talking
WINCE makefile and source data
I would like to ask if anyone has good information about makefile and source under WINCE. I would like to know how to write it. If you have any, please send me a copy, or leave the URL so that I can d...
qzhp Embedded System
Please help me understand the function of this resistor
Please help explain the function of R15, is it feedback? [img]http://hi.eeworld.net/attachment/201001/19/3276840_1263894360sG92.jpg[/img]...
abenxing Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 270  1299  852  2528  103  6  27  18  51  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号