Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Honeywell |
| Parts packaging code | DFP |
| package instruction | DFP, FL24,.4 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 100 ns |
| Other features | RADIATION-HARDENED SRAM |
| I/O type | COMMON |
| JESD-30 code | R-CDFP-F24 |
| JESD-609 code | e0 |
| length | 15.1384 mm |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL24,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535V;38534K;883S |
| Maximum seat height | 3.175 mm |
| Maximum standby current | 0.00009 A |
| Minimum standby current | 2.5 V |
| Maximum slew rate | 0.007 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| total dose | 1M Rad(Si) V |
| width | 10.16 mm |
| HC6216KSHCT | HC6216KCH-T | HC6216JCH-C | HC6216JCH-T | HC6216KSHCC | HC6216JSHCC | HC6216JSHCT | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 |
| Parts packaging code | DFP | DFP | DIP | DIP | DFP | DIP | DIP |
| package instruction | DFP, FL24,.4 | DFP, | DIP, | DIP, | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns |
| Other features | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM | RADIATION-HARDENED SRAM |
| JESD-30 code | R-CDFP-F24 | R-CDFP-F24 | R-CDIP-T24 | R-CDIP-T24 | R-CDFP-F24 | R-CDIP-T24 | R-CDIP-T24 |
| length | 15.1384 mm | 15.1384 mm | 30.48 mm | 30.48 mm | 15.1384 mm | 30.48 mm | 30.48 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Exportable | YES | YES | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | DFP | DIP | DIP | DFP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.175 mm | 3.175 mm | 4.318 mm | 4.318 mm | 3.175 mm | 4.318 mm | 4.318 mm |
| Minimum standby current | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 10.16 mm | 10.16 mm | 15.24 mm | 15.24 mm | 10.16 mm | 15.24 mm | 15.24 mm |
| Is it lead-free? | Contains lead | - | - | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | - | - | incompatible | incompatible | incompatible |
| Maker | Honeywell | Honeywell | - | Honeywell | - | Honeywell | Honeywell |
| I/O type | COMMON | - | - | - | COMMON | COMMON | COMMON |
| JESD-609 code | e0 | - | - | - | e0 | e0 | e0 |
| Output characteristics | 3-STATE | - | - | - | 3-STATE | 3-STATE | 3-STATE |
| Encapsulate equivalent code | FL24,.4 | - | - | - | FL24,.4 | DIP24,.6 | DIP24,.6 |
| Filter level | 38535V;38534K;883S | - | - | - | 38535V;38534K;883S | 38535V;38534K;883S | 38535V;38534K;883S |
| Maximum standby current | 0.00009 A | - | - | - | 0.00009 A | 0.00009 A | 0.00009 A |
| Maximum slew rate | 0.007 mA | - | - | - | 0.007 mA | 0.007 mA | 0.007 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | - | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| total dose | 1M Rad(Si) V | - | - | - | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |