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HC6216KSHCT

Description
Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24
Categorystorage    storage   
File Size492KB,14 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
Download Datasheet Parametric Compare View All

HC6216KSHCT Overview

Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24

HC6216KSHCT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerHoneywell
Parts packaging codeDFP
package instructionDFP, FL24,.4
Contacts24
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time100 ns
Other featuresRADIATION-HARDENED SRAM
I/O typeCOMMON
JESD-30 codeR-CDFP-F24
JESD-609 codee0
length15.1384 mm
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535V;38534K;883S
Maximum seat height3.175 mm
Maximum standby current0.00009 A
Minimum standby current2.5 V
Maximum slew rate0.007 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
total dose1M Rad(Si) V
width10.16 mm

HC6216KSHCT Related Products

HC6216KSHCT HC6216KCH-T HC6216JCH-C HC6216JCH-T HC6216KSHCC HC6216JSHCC HC6216JSHCT
Description Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24
Parts packaging code DFP DFP DIP DIP DFP DIP DIP
package instruction DFP, FL24,.4 DFP, DIP, DIP, DFP, FL24,.4 DIP, DIP24,.6 DIP, DIP24,.6
Contacts 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns
Other features RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM
JESD-30 code R-CDFP-F24 R-CDFP-F24 R-CDIP-T24 R-CDIP-T24 R-CDFP-F24 R-CDIP-T24 R-CDIP-T24
length 15.1384 mm 15.1384 mm 30.48 mm 30.48 mm 15.1384 mm 30.48 mm 30.48 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Exportable YES YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DFP DFP DIP DIP DFP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.175 mm 3.175 mm 4.318 mm 4.318 mm 3.175 mm 4.318 mm 4.318 mm
Minimum standby current 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT FLAT THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 15.24 mm 15.24 mm 10.16 mm 15.24 mm 15.24 mm
Is it lead-free? Contains lead - - - Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible - - - incompatible incompatible incompatible
Maker Honeywell Honeywell - Honeywell - Honeywell Honeywell
I/O type COMMON - - - COMMON COMMON COMMON
JESD-609 code e0 - - - e0 e0 e0
Output characteristics 3-STATE - - - 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code FL24,.4 - - - FL24,.4 DIP24,.6 DIP24,.6
Filter level 38535V;38534K;883S - - - 38535V;38534K;883S 38535V;38534K;883S 38535V;38534K;883S
Maximum standby current 0.00009 A - - - 0.00009 A 0.00009 A 0.00009 A
Maximum slew rate 0.007 mA - - - 0.007 mA 0.007 mA 0.007 mA
Terminal surface Tin/Lead (Sn/Pb) - - - TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
total dose 1M Rad(Si) V - - - 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V
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