EEWORLDEEWORLDEEWORLD

Part Number

Search

HC6216JSHCC

Description
Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24
Categorystorage    storage   
File Size492KB,14 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
Download Datasheet Parametric Compare View All

HC6216JSHCC Overview

Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24

HC6216JSHCC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerHoneywell
Parts packaging codeDIP
package instructionDIP, DIP24,.6
Contacts24
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time100 ns
Other featuresRADIATION-HARDENED SRAM
I/O typeCOMMON
JESD-30 codeR-CDIP-T24
JESD-609 codee0
length30.48 mm
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535V;38534K;883S
Maximum seat height4.318 mm
Maximum standby current0.00009 A
Minimum standby current2.5 V
Maximum slew rate0.007 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
total dose1M Rad(Si) V
width15.24 mm

HC6216JSHCC Related Products

HC6216JSHCC HC6216KCH-T HC6216JCH-C HC6216JCH-T HC6216KSHCC HC6216JSHCT HC6216KSHCT
Description Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDIP24, CERAMIC, DIP-24 Standard SRAM, 2KX8, 100ns, CMOS, CDFP24, CERAMIC, FP-24
Parts packaging code DIP DFP DIP DIP DFP DIP DFP
package instruction DIP, DIP24,.6 DFP, DIP, DIP, DFP, FL24,.4 DIP, DIP24,.6 DFP, FL24,.4
Contacts 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns 100 ns
Other features RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM RADIATION-HARDENED SRAM
JESD-30 code R-CDIP-T24 R-CDFP-F24 R-CDIP-T24 R-CDIP-T24 R-CDFP-F24 R-CDIP-T24 R-CDFP-F24
length 30.48 mm 15.1384 mm 30.48 mm 30.48 mm 15.1384 mm 30.48 mm 15.1384 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Exportable YES YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DFP DIP DIP DFP DIP DFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.318 mm 3.175 mm 4.318 mm 4.318 mm 3.175 mm 4.318 mm 3.175 mm
Minimum standby current 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE FLAT
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 10.16 mm 15.24 mm 15.24 mm 10.16 mm 15.24 mm 10.16 mm
Is it lead-free? Contains lead - - - Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible - - - incompatible incompatible incompatible
Maker Honeywell Honeywell - Honeywell - Honeywell Honeywell
I/O type COMMON - - - COMMON COMMON COMMON
JESD-609 code e0 - - - e0 e0 e0
Output characteristics 3-STATE - - - 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code DIP24,.6 - - - FL24,.4 DIP24,.6 FL24,.4
Filter level 38535V;38534K;883S - - - 38535V;38534K;883S 38535V;38534K;883S 38535V;38534K;883S
Maximum standby current 0.00009 A - - - 0.00009 A 0.00009 A 0.00009 A
Maximum slew rate 0.007 mA - - - 0.007 mA 0.007 mA 0.007 mA
Terminal surface Tin/Lead (Sn/Pb) - - - TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
total dose 1M Rad(Si) V - - - 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1510  312  618  257  1162  31  7  13  6  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号