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N82S2708N

Description
OTP ROM, 1KX8, 70ns, TTL, PDIP24
Categorystorage    storage   
File Size139KB,4 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

N82S2708N Overview

OTP ROM, 1KX8, 70ns, TTL, PDIP24

N82S2708N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
Maximum access time70 ns
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum slew rate0.175 mA
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

N82S2708N Related Products

N82S2708N S82S2708I/883B 82S2708/BYA 82S2708/BLA
Description OTP ROM, 1KX8, 70ns, TTL, PDIP24 OTP ROM, 1KX8, 90ns, TTL, CDIP24 OTP ROM, 1KX8, 90ns, TTL, CDFP24 OTP ROM, 1KX8, 90ns, TTL, CDIP24
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DFP, FL24,.4 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknow unknown
Maximum access time 70 ns 90 ns 90 ns 90 ns
JESD-30 code R-PDIP-T24 R-XDIP-T24 R-XDFP-F24 R-XDIP-T24
JESD-609 code e0 e0 e0 e0
memory density 8192 bit 8192 bit 8192 bi 8192 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of terminals 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000
Maximum operating temperature 70 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -55 °C -55 °C -55 °C
organize 1KX8 1KX8 1KX8 1KX8
Package body material PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DFP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 FL24,.4 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE FLATPACK IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.175 mA 0.185 mA 0.185 mA 0.185 mA
surface mount NO NO YES NO
technology TTL TTL TTL TTL
Temperature level COMMERCIAL MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
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