82S2708/BLA datasheet, PDF - EEWORLD Datasheet

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82S2708/BLA: DescriptionOTP ROM, 1KX8, 90ns, TTL, CDIP24; Categorystorage storage; File Size139KB，4 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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82S2708/BLA Overview

OTP ROM, 1KX8, 90ns, TTL, CDIP24

82S2708/BLA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101289141
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	90 ns
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	1024 words
character code	1000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.185 mA
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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82S2708/BLA Related Products

	82S2708/BLA	S82S2708I/883B	N82S2708N	82S2708/BYA
Description	OTP ROM, 1KX8, 90ns, TTL, CDIP24	OTP ROM, 1KX8, 90ns, TTL, CDIP24	OTP ROM, 1KX8, 70ns, TTL, PDIP24	OTP ROM, 1KX8, 90ns, TTL, CDFP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	DIP, DIP24,.6	DIP, DIP24,.6	DFP, FL24,.4
Reach Compliance Code	unknown	unknown	unknown	unknow
Maximum access time	90 ns	90 ns	70 ns	90 ns
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDFP-F24
JESD-609 code	e0	e0	e0	e0
memory density	8192 bit	8192 bit	8192 bit	8192 bi
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8
Number of terminals	24	24	24	24
word count	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-55 °C
organize	1KX8	1KX8	1KX8	1KX8
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DFP
Encapsulate equivalent code	DIP24,.3	DIP24,.6	DIP24,.6	FL24,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.185 mA	0.185 mA	0.175 mA	0.185 mA
surface mount	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Filter level	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	-	38535Q/M;38534H;883B
Maker	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)

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