OTP ROM, 1KX8, 90ns, TTL, CDFP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DFP, FL24,.4 |
| Reach Compliance Code | unknow |
| Maximum access time | 90 ns |
| JESD-30 code | R-XDFP-F24 |
| JESD-609 code | e0 |
| memory density | 8192 bi |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL24,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 0.185 mA |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| 82S2708/BYA | S82S2708I/883B | N82S2708N | 82S2708/BLA | |
|---|---|---|---|---|
| Description | OTP ROM, 1KX8, 90ns, TTL, CDFP24 | OTP ROM, 1KX8, 90ns, TTL, CDIP24 | OTP ROM, 1KX8, 70ns, TTL, PDIP24 | OTP ROM, 1KX8, 90ns, TTL, CDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| Maximum access time | 90 ns | 90 ns | 70 ns | 90 ns |
| JESD-30 code | R-XDFP-F24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 8192 bi | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 24 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.185 mA | 0.185 mA | 0.175 mA | 0.185 mA |
| surface mount | YES | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| Filter level | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | - | 38535Q/M;38534H;883B |
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