IS63LV1024L-8B datasheet, PDF - EEWORLD Datasheet

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IS63LV1024L-8B: DescriptionStandard SRAM, 128KX8, 8ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36; Categorystorage storage; File Size43KB，9 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS63LV1024L-8B Overview

Standard SRAM, 128KX8, 8ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36

IS63LV1024L-8B Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA
package instruction	TFBGA, BGA36,6X8,30
Contacts	36
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	8 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B36
JESD-609 code	e0
length	10 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	36
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA36,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0015 A
Minimum standby current	2 V
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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IS63LV1024L

128K x 8 HIGH-SPEED CMOS STATIC RAM

3.3V REVOLUTIONARY PINOUT

FEATURES

• High-speed access times:

8, 10, 12 ns

• High-performance, low-power CMOS process

• Multiple center power and ground pins for

greater noise immunity

• Easy memory expansion with

and

options

•

power-down

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Single 3.3V power supply

• Packages available:

– 32-pin 300-mil SOJ

– 32-pin 400-mil SOJ

ISSI

AUGUST 2002

– 32-pin TSOP (Type II)

– 32-pin STSOP (Type I)

– 36-pin BGA (8mmx10mm)

DESCRIPTION

The

ISSI

IS63LV1024L is a very high-speed, low power,

131,072-word by 8-bit CMOS static RAM in revolutionary

pinout. The IS63LV1024L is fabricated using

ISSI

high-performance CMOS technology. This highly reliable

process coupled with innovative circuit design

techniques, yields higher performance and low power

consumption devices.

When

is HIGH (deselected), the device assumes a

standby mode at which the power dissipation can be

reduced down to 250 µW (typical) with CMOS input levels.

The IS63LV1024L operates from a single 3.3V power

supply and all inputs are TTL-compatible.

FUNCTIONAL BLOCK DIAGRAM

A0-A16

DECODER

128K X 8

MEMORY ARRAY

VCC

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. — www.issi.com —

1-800-379-4774

Rev. B

08/07/02

IS63LV1024L-8B Related Products

	IS63LV1024L-8B	IS63LV1024L-12T	IS63LV1024L-12JI	IS63LV1024L-10TI	IS63LV1024L-8BI	IS63LV1024L-10K	IS63LV1024L-10KI	IS63LV1024L-12KI	IS63LV1024L-12K
Description	Standard SRAM, 128KX8, 8ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, PLASTIC, TSOP2-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, TSOP2-32	Standard SRAM, 128KX8, 8ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA	TSOP2	SOJ	TSOP2	BGA	SOJ	SOJ	SOJ	SOJ
package instruction	TFBGA, BGA36,6X8,30	PLASTIC, TSOP2-32	0.300 INCH, PLASTIC, SOJ-32	TSOP2-32	TFBGA, BGA36,6X8,30	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32
Contacts	36	32	32	32	36	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	8 ns	12 ns	12 ns	10 ns	8 ns	10 ns	10 ns	12 ns	12 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B36	R-PDSO-G32	R-PDSO-J32	R-PDSO-G32	R-PBGA-B36	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	10 mm	20.95 mm	20.955 mm	20.95 mm	10 mm	20.955 mm	20.955 mm	20.955 mm	20.955 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	36	32	32	32	36	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C	85 °C	85 °C	70 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP2	SOJ	TSOP2	TFBGA	SOJ	SOJ	SOJ	SOJ
Encapsulate equivalent code	BGA36,6X8,30	TSOP32,.46	SOJ32,.34	TSOP32,.46	BGA36,6X8,30	SOJ32,.44	SOJ32,.44	SOJ32,.44	SOJ32,.44
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	3.566 mm	1.2 mm	1.2 mm	3.7592 mm	3.7592 mm	3.7592 mm	3.7592 mm
Maximum standby current	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.001 A	0.0015 A	0.0015 A	0.001 A
Minimum standby current	2 V	2 V	3 V	3.15 V	2 V	3 V	3.15 V	3 V	3 V
Maximum slew rate	0.1 mA	0.09 mA	0.1 mA	0.105 mA	0.11 mA	0.095 mA	0.105 mA	0.1 mA	0.09 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.45 V	3.45 V	3.45 V	3.6 V	3.45 V	3.45 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3.15 V	3.15 V	3.15 V	3 V	3.15 V	3.15 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING	J BEND	GULL WING	BALL	J BEND	J BEND	J BEND	J BEND
Terminal pitch	0.75 mm	1.27 mm	1.27 mm	1.27 mm	0.75 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	BOTTOM	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	10	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	10.16 mm	7.62 mm	10.16 mm	8 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead

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